2012
DOI: 10.1143/apex.5.021103
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Electrical Properties of Ultrathin SiO$_{2}$ Layer Deposited at 50 $^{\circ}$C by Inductively Coupled Plasma-Enahnced Chemical Vapor Deposition

Abstract: We found a strong correlation between the layer porosity and electrical properties of a SiO 2 layer deposited by inductively coupled plasma chemical vapor deposition. At 50 C the SiO 2 layers have a double structure: a dense layer in contact with the substrate and a porous layer on top of it. The critical thickness at which voids appear depends on the deposition rate. Breakdown voltage and charge trapping performances of SiO 2 layers are very good if the thickness is below the critical value and deteriorate si… Show more

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Cited by 11 publications
(8 citation statements)
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“…The different deposited architectures of SiO 2 occur based on the different temperatures of deposition, at higher temperature leads to greater absorbance due to much smother substrates [ 41 , 42 ]. We expect that at a lower temperature of 50° Celsius, the PECVD deposition structure to be similar to those deposited using ICP PECVD SiO 2 matrixes at these temperatures [ 43 ].…”
Section: Resultsmentioning
confidence: 99%
“…The different deposited architectures of SiO 2 occur based on the different temperatures of deposition, at higher temperature leads to greater absorbance due to much smother substrates [ 41 , 42 ]. We expect that at a lower temperature of 50° Celsius, the PECVD deposition structure to be similar to those deposited using ICP PECVD SiO 2 matrixes at these temperatures [ 43 ].…”
Section: Resultsmentioning
confidence: 99%
“…After high vacuum was established (5x10 -7 Torr) in the process chamber, the a-Si was deposited at 50°C, 10 mTorr and 500 W using 20 sccm of pure SiH 4 gas and 1sccm of Ar to ignite the plasma. An extensive structural characterization of low-temperature plasma grown layers had previously been performed elsewhere [40,41]. The H content measured by Elastic Recoil Detection Analysis (ERDA) is as high as 25% (Fig.…”
Section: Substrate Preparationmentioning
confidence: 99%
“…Low-temperature deposition of silicon oxide (SiO x ) films is required for the fabrication of not only thin-film transistors on non-heat-resistant substrates 1) but also interlayer dielectrics in size-minimizing ICs to suppress the disconnection of the interconnect metal, the redistribution of the dopant, and defect generation in the fabricated underlayer. 2) For low-temperature deposition, plasma-enhanced CVD (PECVD) has been widely used in practice, 1,[3][4][5][6] which requires an expensive system consisting of vacuum equipment and high power supply. In addition, tetraethylorthosilicate [TEOS; Si(OC 2 H 5 ) 4 ] vapor is commonly used as a deposition gas source.…”
Section: Introductionmentioning
confidence: 99%