Electrical resistivity feature of Cu–Sn–(Bi) alloy melts

Li, Cancan; Du, Songzhao; Zhao, Degang; Zhou, Guorong; Geng, Haoran

doi:10.1080/00319104.2013.806214

Cited by 5 publications

(2 citation statements)

References 12 publications

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“…The negative entropy values suggest a structural ordering in the melt (Table 1). in good agreement with the data presented in [11], while no literature data for other melts have been found.…”

Section: Resultssupporting

confidence: 91%

Thermophysical properties of multicomponent model high-entropy melts

Dufanets¹,

Sklyarchuk²,

Plevachuk³

2020

J. Phys. Stud.

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Viscosity, electrical conductivity and thermoelectric power of Cu33.3Bi33.3Sn, Cu25Bi 25Sn25In, Cu20Bi20Sn20In20Pb and Cu20Bi20Sn20Ga20Pb liquid alloys of equiatomic concentrations, which are components of model multicomponent high-entropy alloys, have been studied experimentally. Based on the obtained results, the activation energy of the viscous ow and the entropy of mixing were calculated. The negative values of the entropy of mixing suggest a structural ordering in the system.

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Section: Resultssupporting

confidence: 91%

Thermophysical properties of multicomponent model high-entropy melts

Dufanets¹,

Sklyarchuk²,

Plevachuk³

2020

J. Phys. Stud.

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“…The molten Cu-Sn alloys were studied in the temperature range between the melting points and 1450 K. The Cu-Sn system has complicated phase diagram with numerous phases and chemical compounds. Studies of the resistivity in the liquid state, performed in [6], revealed a discrepancy between the heating and cooling ρ(T) curves in different temperature ranges. For example, violation of the homogeneity of the Cu60Sn40 melt during cooling below 1173 K was explained by the appearance of two kinds of atomic structures, Cu3Sn and Sn.…”

Section: Cu-snmentioning

confidence: 99%

Thermophysical Properties of Cu-Based Subsystems of High-Entropy Alloys

Plevachuk,

Romaka,

Janotova

et al. 2024

DDF

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According to the well-known concept of multicomponent high-entropy alloys, high entropy of mixing can stabilize the formation of solid solutions (simple bcc or fcc crystal structure) during solidification. Stabilization of the solid solution and prevention of the formation of intermetallic phases during solidification is provided by the high entropy of mixing in the solid and liquid states. High-entropy alloys have increased strength, high hardness, thermal stability in combination with good resistance to oxidation and corrosion. These properties allow to significantly expand the scope of these alloys. In this work, the electrical resistivity, thermoelectric power and surface tension of binary Cu–Sn, Cu–Ga and Cu–Bi alloys, which are the sub-system components of model low-temperature high-entropy Bi–Cu–Ga–Pb–Sn alloys, have been studied in a wide temperature range including solid and liquid states. The lack of the surface tension data of the above-mentioned alloys is compensated by the model predicted values.

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