2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) 2012
DOI: 10.1109/eptc.2012.6507174
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Electrical test method and realized system for high pin count components during reliability tests

Oliver Albrecht
1
,
Alexander Klemm
2
,
Martin Oppermann
3
et al.
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Low-cost electrical measurement systems for reliability testing

Oppermann
1
,
Albrecht
2
,
Klemm
3
et al. 2014
Proceedings of the 5th Electronics System-Integration Technology Conference (ESTC)
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Low-cost electrical measurement systems for reliability testing

Oppermann
1
,
Albrecht
2
,
Klemm
3
et al. 2014
Proceedings of the 5th Electronics System-Integration Technology Conference (ESTC)
0
0
0
0
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Study on the Effect of the Warpage of Electronic Assemblies on Their Reliability

Albrecht
1
,
Meier
2
,
Wohlrabe
3
2020
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
2
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Impact of Warpage Effects on Quality and Reliability of Solder Joints

Albrecht
1
,
Wohlrabe
2
,
Meier
3
2019
2019 42nd International Spring Seminar on Electronics Technology (ISSE)
4
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