Electrical Transport Modeling of Graphene-Based Interconnects

Abstract

Due to the downscaling in the design of modern ICs, copper interconnects reach their limitations such as delay, power dissipation, and electromigration. However, a new era of discovered materials, including carbon nanotube, graphene nanoribbon (GNR), and their composite, has been proposed as promising alternatives for interconnect applications. The purpose of this review is to give an overview of the various approaches that are used to model graphene-based interconnects. In this work we focus on why opting for graphene-based interconnect properties as an alternative for copper interconnect replacement; what are the deep theories, which are explaining the electrical transport on those interconnects; and what are the electrical models that are used to model the various kind of graphene-based interconnects.

A comparative study of propagation delay applied on varieties carbon nanotubes Bundles interconnects using the FDTD and the ABCD matrix method

“…For years, the dominant material empoyed for their design was copper but with the current technology node, it start to be limited beyond 14nm [2]. Most of the research introduce carbon nanotubes (CNTs), either single-walled (SWCNTs), multiwalled (MWCNTs), or combination with copper as a future replacement of Cu to counter its weakness [3,4].…”