“…While some research has been done in collaboration with industrial partners [160], there is currently, to the best of the authors' knowledge, no instance of CNT array TIM in a commercial application. There results are promising, and could lead to a new class of TIMs with thermal performance in the same range as solders, while absorbing strain through a mechanically decoupled interface like thermal grease and, in the case of double-sided foil CNT array TIM, the handling properties associated with thermal pads.…”