20th International Workshop on Thermal Investigations of ICs and Systems 2014
DOI: 10.1109/therminic.2014.6972534
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Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats

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Cited by 4 publications
(2 citation statements)
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“…While some research has been done in collaboration with industrial partners [160], there is currently, to the best of the authors' knowledge, no instance of CNT array TIM in a commercial application. There results are promising, and could lead to a new class of TIMs with thermal performance in the same range as solders, while absorbing strain through a mechanically decoupled interface like thermal grease and, in the case of double-sided foil CNT array TIM, the handling properties associated with thermal pads.…”
Section: Discussionmentioning
confidence: 99%
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“…While some research has been done in collaboration with industrial partners [160], there is currently, to the best of the authors' knowledge, no instance of CNT array TIM in a commercial application. There results are promising, and could lead to a new class of TIMs with thermal performance in the same range as solders, while absorbing strain through a mechanically decoupled interface like thermal grease and, in the case of double-sided foil CNT array TIM, the handling properties associated with thermal pads.…”
Section: Discussionmentioning
confidence: 99%
“…Recently, progress has been made towards non-metal bonding of CNT arrays using polymer coatings [157][158][159][160] or chemical functionalisation [133,161,162]. Polymer bonding can serve to increase real contact area, as demonstrated using a spray on polymer coating together with a solvent, which pull CNTs into contact using capillary forces [158].…”
Section: Bonding Of Cnt Arraysmentioning
confidence: 99%