Electrically induced stimuli for MEMS self-test

Charlot, B.; Mir, Salvador; Parrain, Fabien; Courtois, B.

doi:10.1109/vts.2001.923441

Cited by 37 publications

(24 citation statements)

References 15 publications

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“…Indeed, MEMS characteristics depend on the properties and the quality of the package used. As a result, the cost of MEMS testing can be prohibitive [34].…”

Section: Analog Rf and Mems Componentsmentioning

confidence: 99%

System-in-Package, a Combination of Challenges and Solutions

Cauvet¹,

Bernard

Renovell

2007

12th IEEE European Test Symposium (ETS'07)

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System-in-Package(SiP) has recently become a significant technology in the semiconductor industry, offering to the consumer applications many new product features without increasing the overall form factor. In this talk, the basic SiP concepts are first discussed, showing difference between SiP and SoC, illustrated by some examples, drawn from real-life cases. The specific challenges are considered from the testing point of view, focussing on the assembled yield and defect level for the packaged SiP. Various bare-die test techniques to find known-good-dies are described including their limitations, followed by two techniques to test the SiP at the system level: functional system test and embedded component test. A brief discussion on future SiP design and test challenges concludes the presentation.

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“…Indeed, MEMS characteristics depend on the properties and the quality of the package used. As a result, the cost of MEMS testing can be prohibitive [34].…”

Section: Analog Rf and Mems Componentsmentioning

confidence: 99%

System-in-Package, a Combination of Challenges and Solutions

Cauvet¹,

Bernard

Renovell

2007

12th IEEE European Test Symposium (ETS'07)

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“…Since then a few other methodologies, following similar approaches, have been proposed for accelerometer testing (Charlot et al 2001;Mir et al 2006;Olbrich et al 1997;Puers and Reyntjens 2002;Xiong et al 2005). The test is limited to the verification whether the mass is free to move and an electrical signal is used to stimulate the device.…”

Section: Introductionmentioning

confidence: 99%

Auto-calibration of capacitive MEMS accelerometers based on pull-in voltage

et al. 2011

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This paper describes an electro-mechanical auto-calibration technique for use in capacitive MEMS accelerometers. Auto-calibration is achieved using the combined information derived from an initial measurement of the resonance frequency and the measurement of the pull-in voltages during device operation, with an estimation of process-induced variations in device dimensions from layout and deviations in material properties from the known nominal value. An experiment-based analytical model is used to compute the required electrostatic forces required to simulate external accelerations allowing the electro-mechanical calibration of the accelerometer. Measurements on fabricated devices confirm the validity of the proposed technique and electro-mechanical calibration is experimentally demonstrated.

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“…The tests that are run after fabrication, under different operating conditions, ensure that only suitable devices are commercialized. However, these tests are very costly: a typical figure is that one third of the cost of a micro-fabricated device is due to testing [5]. An alternative is to integrate self-test (and self-tuning) features, such as parameter estimation routines, in each device, so that it can compensate the fabrication dispersions and adapt to changing conditions.…”

Section: Introductionmentioning

confidence: 99%