2016
DOI: 10.3389/fmats.2016.00011
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Electro-Mechanical Testing of Conductive Materials Used in Flexible Electronics

Abstract: The use of flexible electronics has increased in recent years. In order to have robust and long lasting flexible displays and sensors, the combined electro-mechanical behavior needs to be assessed. The most common method to determine electrical and mechanical behavior of conductive thin films used in flexible electronics is the fragmentation test or uniaxial tensile straining of the film and substrate. When performed in situ, fracture and deformation behavior can be determined. The use of in situ electrical re… Show more

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Cited by 39 publications
(27 citation statements)
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“…A 300 nm sputtered Au film on PI reaches a peak stress of about 450 MPa when strained and measured in-situ with XRD. [29] In the unloaded state, the measured stresses are initially 90 MPa compressive and steadily increase to a constant value of about 350 MPa compressive after a maximum applied strain of 6%. Comparing the in-situ XRD to the optical experiments, finds that there is a good agreement between the two tests.…”
Section: Resultsmentioning
confidence: 99%
See 2 more Smart Citations
“…A 300 nm sputtered Au film on PI reaches a peak stress of about 450 MPa when strained and measured in-situ with XRD. [29] In the unloaded state, the measured stresses are initially 90 MPa compressive and steadily increase to a constant value of about 350 MPa compressive after a maximum applied strain of 6%. Comparing the in-situ XRD to the optical experiments, finds that there is a good agreement between the two tests.…”
Section: Resultsmentioning
confidence: 99%
“…[10][11][12][13] Both of these methods examine the cracking behavior as well as the electrical behavior. [28,29] Noble metals, such as Au or Ag, are the materials of choice for the connecting lines between the semiconducting islands. [14][15][16][17][18][19] While, these methods work well for films on rigid substrates in the case of flexible electronics, the matter becomes more challenging and the methods and models for rigid substrates cannot always be employed.…”
Section: Introductionmentioning
confidence: 99%
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“…The difference between the films is the addition of a 10 nm Cr interlayer used to improve adhesion. The two films were subjected to 225 cycles of 2% strain under a CLSM to record surface damage and the electrical resistance with 4PP [15]. CLSM images are similar to AFM images in that three dimensional information is obtained over larger areas and the imaging only takes a few minutes.…”
Section: Cyclic Tensile Loadingmentioning
confidence: 99%
“…With this technique, larger delaminations, both in height and width, can be analyzed and used to measure adhesion. 23 An early indentation-induced interfacial fracture test was developed by Marshall and Evans. 5,6 Improvements and updates to the original models of Marshall and Evans 5 and Hutchinson and Suo 10 were added by Kriese et al 9 and Cordill et al 12 Briefly, the Marshall and Evans model required that the indent volume remains within the film (Fig.…”
Section: Introductionmentioning
confidence: 99%