2017 International Conference on Engineering &Amp; MIS (ICEMIS) 2017
DOI: 10.1109/icemis.2017.8273068
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Electro-thermal modeling of power IGBT modules by heat pipe systems

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Cited by 6 publications
(2 citation statements)
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“…Heat pipes can be embedded in conductive plates or heat sinks for increasing heat spread or transfer capabilities [1]. Integration of heat pipes in electronic devices has been investigated for automotive applications [16]- [18] due to their high thermal conductivity, efficiency, flexibility, and suitable range of working temperature without consuming any additional electric energy.…”
Section: Cooling Sytem Design Approachmentioning
confidence: 99%
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“…Heat pipes can be embedded in conductive plates or heat sinks for increasing heat spread or transfer capabilities [1]. Integration of heat pipes in electronic devices has been investigated for automotive applications [16]- [18] due to their high thermal conductivity, efficiency, flexibility, and suitable range of working temperature without consuming any additional electric energy.…”
Section: Cooling Sytem Design Approachmentioning
confidence: 99%
“…Two objective functions, volume of the converter and power efficiency of the cooling system, have been selected as the design space. Since the fan is the only component that consumes power, the efficiency, η, of the cooling system is defined by the power efficiency of the fan by η = dP T v P in (18) dP T is the pressure drop for the corresponding volumetric air flow, v, of the fan's operating point and P in is the power consumption of the fan. The length and width of the cooling system are determined within the power converter package which can be maximum of 155 and 50 mm, respectively, and the only parameter that changes the volume of the entire converter is the height of the heat sink, h f .…”
Section: Optimization Of Cooling Designmentioning
confidence: 99%