Electrochemical behavior of Sn-Zn alloys with different grain structures in chloride-containing solutions

Méndez, C. M.; Scheiber, Verónica Liliana; Rozicki, Roberto S.; Kociubczyk, Alex Iván; Ares, Alicia Esther

doi:10.1016/j.arabjc.2016.12.019

Cited by 13 publications

(4 citation statements)

References 45 publications

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“…The corrosion behaviour of Sn-Zn alloys in aqueous solution has been the topics of previous investigations. Mendez et al [6] worked on the hypoeutectic Sn-Zn alloys (Zn: <9.0wt.%) with two different types of grain structures: columnar and equiaxed zone, suggesting that the corrosion resistance decreases with increasing the Zn contents. Liu et al [7] investigated the pitting phenomenon of Sn-xZn (x=6.5, 9.0, 12.0 wt.%) binary alloys in aerated and quiescent 0.5 M NaCl solution, demonstrating that the pitting susceptibility increases with increasing the Zn contents, which is ascribed to the defects along the intergranular boundaries between Zn-rich phase and Sn matrix.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical corrosion behaviour of Sn-Zn-xBi alloys used for miniature detonating cords

Liu

Khorsand

2019

Journal of Materials Science & Technology

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Electrochemical corrosion behaviour of Sn-3Zn-xBi (x=0, 1, 3, 5, 7 wt.%) solder alloys were investigated using potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) techniques, to explore the effect of Bi on corrosion performance of the Sn-Zn alloy. Results indicated that minor (1 wt.%) Bi addition increased the corrosion susceptibility, mainly attributed to the coarsened and more uniformly distributed Zn-rich precipitates, while further increasing Bi decreased the corrosion susceptibility due to the higher fraction of nobler Bi particles serving as anodic barriers. The Sn-3Zn-7Bi possessed the best corrosion resistance among all alloys. The role of Bi on corrosion was considerably discussed.

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Section: Introductionmentioning

confidence: 99%

Electrochemical corrosion behaviour of Sn-Zn-xBi alloys used for miniature detonating cords

Liu

Khorsand

2019

Journal of Materials Science & Technology

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“…Noble elements (Cu and Ag) are also utilized in small concentrations. Zn forms a eutectic with Sn at 8.9 wt.% Zn [ 7 ]. The eutectic alloy has a low melting point (199 °C) which is very close to that of the eutectic Sn–Pb solder (183 °C).…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Corrosion Behavior of Sn–Zn Alloys

et al. 2022

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In the present work, the microstructure, phase constitution, and corrosion behavior of binary Sn–xZn alloys (x = 5, 9 and 15 wt.%) were investigated. The alloys were prepared by induction melting of Sn and Zn lumps in argon. After melting, the alloys were solidified to form cast cylinders. The Sn–9Zn alloy had a eutectic microstructure. The Sn–5Zn and Sn–15Zn alloys were composed of dendritic (Sn) or (Zn) and eutectic. The corrosion behavior of the Sn–Zn alloys was studied in aqueous HCl (1 wt.%) and NaCl (3.5 wt.%) solutions at room temperature. Corrosion potentials and corrosion rates in HCl were significantly higher compared to NaCl. The corrosion of the binary Sn–Zn alloys was found to take place by a galvanic mechanism. The chemical composition of the corrosion products formed on the Sn–Zn alloys changed with the Zn weight fraction. Alloys with a higher concentration of Zn (Sn–9Zn, Sn–15Zn) formed corrosion products rich in Zn. The Zn-rich corrosion products were prone to spallation. The corrosion rate in the HCl solution decreased with decreasing weight fraction of Zn. The Sn–5Zn alloy had the lowest corrosion rate. The corrosion resistance in HCl could be considerably improved by reducing the proportion of zinc in Sn–Zn alloys.

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“…However, despite all the benefits of Sn-Pb solders, Pb is toxic and increasing use of the electronic device in 1990s led to environmental concern on electronic devices disposal. Hence the RoHS directive was introduced in the European Union, EU in 2006 to prohibit the use of toxic and harmful elements in all electronic devices such as lead (Pb,) mercury (Hg) and cadmium (Cd) [1]. As a result, researchers and the electronics manufacturing industry have focusing their efforts on developing Pb-free solder to replace Sn-Pb solder which resulting new Pb-free solders such as Sn-Zn [1], Sn-Bi [2], Sn-Cu [3] and Sn-Ag.…”

Section: Introductionmentioning

confidence: 99%

The Influence of Indium, In on Microstructure Evolution During Isothermal Aging of Sn-0.7Cu

Ghazali

Sharif

2022

J. Phys.: Conf. Ser.

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This paper reports influence of isothermal aging on bulk solder and the microstructure evolution of commercial Sn-0.7Cu (Sn-0.7Cu-0.05Ni+Ge) Pb-free solder alloy with addition of bismuth (Bi) and indium (In). Sn-0.7Cu, Sn-0.7Cu-1.0Bi, Sn-0.7Cu-1.0Bi-1.0In, Sn-0.7Cu-1.0Bi-4.0In, Sn-0.7Cu-1.0Bi-7.0 In solder alloys were prepared via casting process. The solder alloys were aged isothermally at 180°C for 500 hours and microstructure was compared with that of as-cast solder. Microstructure of bulk solder and melting temperatures were analysed via scanning electron microscopy, SEM and differential scanning calorimetry, DSC. The addition of In up to 7 wt% reduced the melting temperature from 231.1 to 218.5°C, and crystallisation temperature from 205.8 to 194.7°C with decreasing degree of undercooling which indicates that the In-added solder alloy had faster nucleation rate. Microstructure evaluation showed that as the amount of indium added increased to 7.0 wt%, the ß-Sn grains became smaller suggesting a refinement effect with In addition. Indium addition also encouraged the formation of Sn-In and Bi-In IMC which increased as the amount of In increased. These IMCs could potentially act as blocking mechanism for deformation leading to higher strength.

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Electrochemical behavior of Sn-Zn alloys with different grain structures in chloride-containing solutions

Cited by 13 publications

References 45 publications

Electrochemical corrosion behaviour of Sn-Zn-xBi alloys used for miniature detonating cords

Electrochemical corrosion behaviour of Sn-Zn-xBi alloys used for miniature detonating cords

Microstructure and Corrosion Behavior of Sn–Zn Alloys

The Influence of Indium, In on Microstructure Evolution During Isothermal Aging of Sn-0.7Cu

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