Electrochemical deposition of barium titanate thin films on TiN/Si substrates

Plasma deposition of thin layers containing titanium and barium with the use of DBD

“…Materials such as BaTiO 3 , due to their high dielectric constant [1][2][3][4][5][6][7][8], are commonly used in microelectronic devices such as multilayer ceramic capacitors [1,[4][5][6][7][8][9][10][11][12], random-access memories (RAM) [2,4,5,7,11,12], optoelectronic devices [1,5,7,10] or sensors [6,13,14].…”

“…a e-mail: malgorzata.majdak@itr.org.pl tion (for example, RF-CVD) [7,9,11] required using high temperatures, usually above 500…”

“…• C [5,7,11]. However, the thermal stress often results in cracking or peeling of the deposited thin films [7,11].…”

“…However, the thermal stress often results in cracking or peeling of the deposited thin films [7,11]. Some of previously applied methods require the use of substrate, that contains one of the compounds of BaTiO 3 .…”

“…Some of previously applied methods require the use of substrate, that contains one of the compounds of BaTiO 3 . For example: in the hydrothermal-electrochemical method in which BaTiO 3 layer was deposited on the substrate made of titanium sheets [7] or in the electrochemical deposition used by Zeng et al who used the TiN-coated Si substrate [11].…”