Electrochemical deposition of copper and ruthenium on titanium

Galvanic deposition of Rh and Ru on randomly structured Ti felts for the electrochemical NH3synthesis

“…40,[56][57][58] Due to its corrosion resistance Ti is particularly interesting as support material for Ru coatings. Several studies have been published about electroplating of Ru on planar Ti substrates, [59][60][61][62] but to the best of our knowledge similar to Rh there are no reports available about electrodeposition of Ru on Ti felts.…”

Formation of PbTe nanofilms by electrochemical atomic layer deposition (ALD)

“…The author's group and others have worked extensively on the growth of compound semiconductor nanofilms, and more recently on the growth of metal nanofilms using electrochemical atomic layer deposition [3,[33][34][35][36][37][38][39][40][41][42][43][44][45]. Electrochemical ALD makes use of underpotential deposition (UPD) [46][47][48][49], a phenomenon where an atomic layer of one element deposits on a second, at a potential prior to that needed to form bulk deposits.…”

Analysis of Ruthenium Electrodeposition in the Nitric Acid Medium

“…Many electrochemical methods such as cyclic or potentiostatic deposition have been employed to obtain Ru materials, which are considered to be more efficient, less costly, and easy to adapt to industrialization. , The studies of separating Ru from simulated HLLW under different conditions by constant potential electro-oxidation have been reported a lot. − Another method is cathodic electrodeposition; however, Ru tends to oxidize in an aqueous environment, and for this reason, research is normally undertaken in ionic liquids . Commercial electrodeposition of Ru usually occurs in electrolytes based on sulfamate, by which a good cathodic efficiency (>90%) and a crack-free coating with a thickness up to 12 μm can be obtained. , In order to solve the intrinsic problem of slow kinetics for Ru deposition, Oppedisano et al have electrodeposited metal Ru from aqueous solution at a high cathodic overpotential, and fernlike deposits were observed at the substrate surface . However, either the studies of Ru electrodeposition in the nitric acid medium or the mechanism of Ru nucleation growth is virtually absent from the literature.…”

“…20 Commercial electrodeposition of Ru usually occurs in electrolytes based on sulfamate, by which a good cathodic efficiency (>90%) and a crack-free coating with a thickness up to 12 μm can be obtained. 3,21 In order to solve the intrinsic problem of slow kinetics for Ru deposition, Oppedisano et high cathodic overpotential, and fernlike deposits were observed at the substrate surface. 22 However, either the studies of Ru electrodeposition in the nitric acid medium or the mechanism of Ru nucleation growth is virtually absent from the literature.…”