Electrochemical etching in HF solution for silicon micromachining

Barillaro, Giuseppe; Nannini, Andrea; Piotto, M.

doi:10.1016/s0924-4247(02)00385-0

Cited by 103 publications

(58 citation statements)

References 11 publications

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“…In a recent work, we demonstrated that the commonly accepted constraints on macropore dimension and pitch (once the resistivity of the silicon substrate is chosen) can be significantly relaxed [9]. In ref.…”

Section: Resultsmentioning

confidence: 99%

“…In ref. [9] regular pores with sides ranging from 2 µm up to 15 µm and pitch variation up to 100% were fabricated on the same 2.4÷4 Ω·cm silicon substrate. Moreover, we showed that macropore formation is just a feature of photo-electrochemical etching and that by changing the initial pattern it is possible to fabricate a variety of silicon microstructures with more complicated shape [8].…”

Section: Resultsmentioning

confidence: 99%

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Fabrication of regular silicon microstructures by photo‐electrochemical etching of silicon

Barillaro

Bruschi

Diligenti

et al. 2005

phys. stat. sol. (c)

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PACS 81.05. Cy, 82.45.Qr, 82.45.Vp In this paper photo-electrochemical etching of silicon in HF-based solutions is employed as a versatile technique for fabrication of original silicon microstructures, alternative to commonly used methods. Photo-electrochemical etching, a well known technique for regular macropore formation, has been exploited to produce a multitude of different regular silicon microstructures (microtubes, microtips, microchannels, microspirals, micropillars, microwalls, etc.). This micromachining technique is here detailed and some applications are reported.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Fabrication of regular silicon microstructures by photo‐electrochemical etching of silicon

Barillaro

Bruschi

Diligenti

et al. 2005

phys. stat. sol. (c)

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“…1b). The KOH etching forms full V-grooves in the straight-line area, which are used as initial seeds for silicon trenching by means of the following electrochemical etching step (Barillaro et al 2002b(Barillaro et al , 2008, and a microchannel having trapezoidal section in the squared frame area, which surrounds the V-grooves and is exploited in optofluidic applications for filling all the trenches with suitable liquid. Electrochemical etching in a HF-based solution (HF:H 2 O = 5%:95% by volume, with the addition of 1,000 ppm of Sodium Lauryl Sulfate, SLS, used as surfactant) is properly controlled to produce deep regular trenches in the patterned substrate and, in turn, a vertical, high aspect-ratio silicon/air PhC micromirror (Fig.…”

Section: Optofluidic Sectionmentioning

confidence: 99%

Integrated optofluidic microsystem based on vertical high-order one-dimensional silicon photonic crystals

Barillaro

Merlo

Surdo

et al. 2011

Microfluid Nanofluid

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In this work, fabrication and testing of an optofluidic microsystem exploiting high aspect-ratio, vertical, silicon/air one-dimensional (1D) photonic crystals (PhC) are reported. The microsystem is composed of an electrochemically micromachined silicon substrate integrating a 1D PhC featuring high-order bandgaps in the near-infrared region, bonded to a glass cover provided with inlet/outlet holes for liquid injection/extraction in/out the PhC-itself. Wavelength shifts of the reflectivity spectrum of the photonic crystal, in the range 1.0-1.7 lm, induced by flow of different liquids through the PhC air gaps are successfully measured using an in-plane all-fibre setup, thanks to the PhC high aspect-ratio value. Experimental results well agree with theoretical predictions and highlight the good linearity and high sensitivity of such an optofluidic microsystem in measuring refractive index changes. The sensitivity value is estimated to be 1,049 nm/RIU around 1.55 lm, which is among the highest reported in the literature for integrated refractive index sensors, and explained in terms of enhanced interaction between light and liquid within the PhC.

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“…Studies of optical characteristics of such photonic crystals showed that they can be successfully used in the mid IR region of the spectrum [2,3]. Later, simi lar structures were obtained using photoelectrochemi cal etching (PECE) of silicon with (100) orientation [4][5][6][7]; previously, this method had been mainly used to obtain a 2D periodic lattice in macroporous silicon [8][9][10]. The advantages of the PECE method as com pared to anisotropic etching consist in the use of a sub strate with the standard (100) orientation, in the absence of a necessity to precisely orient the pattern of the photomask with respect to crystallographic axes, and the possibility of fabricating simultaneously the trenches and macropores in a unified process [11,12].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of one-dimensional photonic crystals by photoelectrochemical etching of silicon

Zharova

Гущина

et al. 2010

Semiconductors

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Abstract-The conditions of formation of deep periodic trenches by photoelectrochemical etching of n Si (100) with linear seeds on the surface are analyzed. Criteria for the proper choice of the period of seed grooves and the etching current density in relation to the doping level of the substrate are formulated. Corrugation of walls is a characteristic feature of the obtained structures; this corrugation is caused by traces of merged macropores. Atomic force microscopy is used to study roughness of the side walls in relation to the etching conditions; the current density at which one can obtain the smoothest side walls is determined. The rough ness of the side walls in structures with periods of 7 and 9 μm on Si with the resistivity of 15 Ω cm amounts tõ 40 nm. It is shown that additional treatment of the structures in alkaline solutions can decrease the side wall roughness by approximately a factor of 2.

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Electrochemical etching in HF solution for silicon micromachining

Cited by 103 publications

References 11 publications

Fabrication of regular silicon microstructures by photo‐electrochemical etching of silicon

Fabrication of regular silicon microstructures by photo‐electrochemical etching of silicon

Integrated optofluidic microsystem based on vertical high-order one-dimensional silicon photonic crystals

Fabrication of one-dimensional photonic crystals by photoelectrochemical etching of silicon

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