Electrochemical Investigation on the Effect of Silver Addition on Wettability of Sn-Zn System Lead-free Solder.

Takemoto, Tadashi; Funaki, Tatsuya; Matsunawa, Akira

doi:10.2207/qjjws.17.251

Cited by 28 publications

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“…In order to improve the oxidation resistance and wetting behavior, Ag has been selected to add into Sn-Zn solder. 8,9 Recent studies 10 revealed that the addition of Ag in Sn-Zn alloy results in the appearance of AgZn intermetallics, and these intermetallic particles will settle at the bottom of the molten solder when isothermally heated at 250°C. Ag-Zn compounds were also observed in the interfacial region between Sn-Zn-Ag and Cu substrate.…”

Section: Introductionmentioning

confidence: 99%

Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Song

Liu

Shih

et al. 2005

J. Electron. Mater.

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This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag 5 Zn 8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn 3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn 3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

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Section: Introductionmentioning

confidence: 99%

Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Song

Liu

Shih

et al. 2005

J. Electron. Mater.

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“…Alloying elements of In, 6) Bi, 7) Al, 8) Ag 9) and rare earths (RE, mainly La and Ce) 10,11) were chosen to lower the melting temperature or improve the wettability. As for the effect of the alloying additions on melting point, previous investigations indicated that Bi and In effectively decrease the melting temperature of Sn-Zn alloy, while there is no significant change in the melting point with small additions of Ag, Al and RE.…”

Section: Introductionmentioning

confidence: 99%

Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys

2004

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The effects of Ga content on the microstructure, thermal behavior and mechanical properties of Sn-Zn eutectic alloy were examined in this study. Results show that Ga was dissolved in both Sn and Zn phases. This gave rise to irregular eutectic structure with misaligned, less distributed massive Zn-rich phase, relatively low melting point, and solid solution strengthening effect. Due to the inhomogeneous dissolution feature of Ga in Sn matrix, Sn-Zn-Ga alloys exhibit a broad melting range and an alternate normal-irregular eutectic structure. Notably, the addition of Ga into the Sn-Zn alloy will improve the tensile strength without reducing the ductility when the Ga content ranges from 0.05 to 1 mass%.

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“…Studies show that improvements in wetting ability and oxidation resistance can be achieved through silver doping. 10) Therefore, Sn-Zn-Ag alloys show potential as lead-free solder materials. To fully exploit the suitability of Sn-Zn-Ag alloys as proper replacements for Sn-Pb alloys, various thermal, physical, and mechanical properties of the alloys need to be studied.…”

Section: -7)mentioning

confidence: 99%

Pasty Ranges and Latent Heat Release Modes for Sn-9Zn-<i>x</i>Ag Lead-free Solder Alloys

Tsai

Hwang

2004

Mater. Trans.

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The pasty ranges and latent heat release modes of Sn-9Zn-xAg alloys, where x varies between 0.5 and 3.5, are examined in this study. The effects of alloy composition and cooling rate on the pasty range and latent heat release modes are also investigated. A Computer Aided-Cooling Curve Analysis (CA-CCA) technique is used to determine the pasty ranges and latent heat release modes for the alloys. To comply with the requirements of CA-CCA, the heat transfer conditions of the experimental setup must closely resemble of a lumped system, in which the alloy is cooled in a uniform fashion. To confirm this, two thermocouples are inserted into the crucible where the alloy is melted and subsequently resolidified. The crucible is used with and without a covering of insulating material to obtain different cooling rates. The temperature readings show that the heat transfer conditions in the experimental setup indeed meet the requirements of a lumped system. The solid fraction versus temperature relationship ( f s -T) for the various alloy compositions and cooling rates are obtained from the temperature data through CA-CCA. The experimental results show that as the silver content of the Sn-9Zn-xAg alloy increases, the liquidus temperature rises and the pasty range broadens. The pasty range is approximately 2 C for 0.5Ag, 9 C for 1.5Ag, 14 C for 2.5Ag, and 18 C for 3.5Ag. As long as the silver content is below 0.5 mass%, silver has little effect on the microstructure, which is basically the eutectic Sn-9Zn and the f s -T relationship is nearly a vertical line. However, as the silver content exceeds 1.5 mass%, the formation of Ag-Zn intermetallic compounds becomes obvious. This causes the alloy composition to deviate from eutectic and to lean towards the tin side of the Sn-Zn phase diagram. This in turn causes the proportion of the primary tin phase to increase and that of the zinc-tin eutectic phase to decrease. This is reflected on the plot of the f s -T relationship by two distinct vertical regions. One corresponds to the primary tin phase and the other to the eutectic phase. As the silver content further increases, the effects of intermetallic compound formation become even more obvious. As an alternative to CA-CCA, Huang's model can be used to obtain a quantitative f s -T function. As the silver content increases, the primary solid fraction for Huang's model increases. As the cooling rate increases, the primary solid fraction and the nonlinearity factors n e and n p decrease.

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Electrochemical Investigation on the Effect of Silver Addition on Wettability of Sn-Zn System Lead-free Solder.

Cited by 28 publications

References 0 publications

Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys

Pasty Ranges and Latent Heat Release Modes for Sn-9Zn-<i>x</i>Ag Lead-free Solder Alloys

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