Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Song, Jenn‐Ming; Liu, Pei-Chi; Shih, Chia-Ling; Lin, Kwang‐Lung

doi:10.1007/s11664-005-0270-7

Cited by 41 publications

(23 citation statements)

References 18 publications

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“…The additional nodules are AgZn 3 IMCs, as shown in Table 2. This is similar to the result of the study by Song et al [12]. The additional nodules beside the planar layer grow up gradually as the content of Ag increases, as shown in Figs.…”

Section: Microstructure Of Sn-9zn-xag Solderssupporting

confidence: 91%

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

et al. 2009

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The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-AgZn 3 from the liquid solder on preformed interfacial intermetallics (Cu 5 Zn 8 ). The peripheral AgZn 3 , nodular on the Cu 5 Zn 8 IMCs layer, is likely to be generated by a peritectic reaction L + γ-Ag 5 Zn 8 → ε-AgZn 3 and the following crystallization of AgZn 3 .

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Section: Microstructure Of Sn-9zn-xag Solderssupporting

confidence: 91%

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

et al. 2009

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“…A metastable b¢ phase is reported. 18 Since the b¢ phase is formed by quenching, the interfacial reaction product is more likely to be the stable f-AgZn phase, as was illustrated previously. 18 Fig.…”

Section: Resultsmentioning

confidence: 77%

“…Yen et al 17 observed the formation of the three same phases in the Sn-9wt.%Zn/Ag couples reacted at 260°C. Song et al 18 reported the formation of only two phases in the Sn-Zn/Ag couples, and they pointed out that the e-AgZn 3 phase was formed from solidification. Based on the results of different reaction time and quenching rates, it is confirmed that the e-AgZn 3 phase is an interfacial reaction product in the Sn-Zn-Bi/Ag couples.…”

Section: Resultsmentioning

confidence: 99%

Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates

Yang

Chen

et al. 2007

Journal of Elec Materi

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Sn-Zn-Bi alloys are promising Pb-free solders. Interfacial reactions between the Sn-8wt.%Zn-3wt.%Bi (Sn-13.80at.%Zn-1.62at.%Bi) alloy and the Cu, Ag, and Ni substrates are examined. Two different kinds of substrates, the bulk plate and the electroplating layer, are used, and the reactions are carried out at 250°C and 220°C. Although the Zn content is only 13.8 at.%, two Zn-Cu compounds, c-Cu 5 Zn 8 and e-CuZn 5 phases, are formed in the Sn-13.80at.%Zn-1.62at.%Bi/Cu couples. The e-CuZn 5 phase is scallop shaped, and the c-Cu 5 Zn 8 phase is planar. In the Sn-13.80at.%Zn-1.62at.%Bi/Ag couples, three Zn-Ag compounds are observed, and they are e-AgZn 3 , c-Ag 5 Zn 8 , and f-AgZn phases. In the Sn-13.80at.%Zn-1.62at.%Bi/Ni couples, a Zn-Ni compound, c-Ni 5 Zn 21 phase, is formed. Similar results are found in the couples prepared with an electroplating layer: the reaction phases are the same, but the growth rates are different.

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“…4a suggests the formation of Ag 5 Zn 8 over the Ag substrate and the subsequent formation of AgZn 3 by the peritectic reaction: L + c-Ag 5 Zn 8 fi e-AgZn 3 . 21 According to Song et al, 22 Ag 5 Zn 8 can easily precipitate over the entire Ag surface due to the similar crystal structure (cubic) and the small lattice mismatch, making it the first IMC to form over a Ag substrate. It should be noted that more than half of the deposited Ag layer remains unreacted.…”

Section: Microstructure Of Sn-1zn/ag Solder Jointmentioning

confidence: 99%

Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM

Jee

2010

Journal of Elec Materi

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The solder joint microstructures of immersion Ag with Sn-xZn (x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn 3 /Ag 5 Zn 8 at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into Cu 5 Zn 8 and Ag 3 Sn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu 6 Sn 5 phase at the joint interface.

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Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Cited by 41 publications

References 18 publications

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder with Cu, Ag, and Ni Substrates

Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM

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