2009
DOI: 10.1016/j.hydromet.2009.06.009
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Electrochemical modeling and study of copper deposition from concentrated ammoniacal sulfate solutions

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Cited by 29 publications
(13 citation statements)
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“…Peak A at −450 mV (vs Ag/AgCl) corresponds to a reduction of Cu(II)/Cu(I), whereas peak B at −150 mV (vs Ag/AgCl) corresponds to a reduction of Cu(I)/Cu(0). These results are similar to the results obtained by other researchers in studies on the electrochemical behaviour of copper/ammonium solutions (Giannopoulou et al, 2009;Koyama et al, 2006;Vazquez-Arenas et al 2007).…”
Section: Resultssupporting
confidence: 92%
“…Peak A at −450 mV (vs Ag/AgCl) corresponds to a reduction of Cu(II)/Cu(I), whereas peak B at −150 mV (vs Ag/AgCl) corresponds to a reduction of Cu(I)/Cu(0). These results are similar to the results obtained by other researchers in studies on the electrochemical behaviour of copper/ammonium solutions (Giannopoulou et al, 2009;Koyama et al, 2006;Vazquez-Arenas et al 2007).…”
Section: Resultssupporting
confidence: 92%
“…The linearized forms of pseudo-first order and pseudo-second order kinetic models are shown by Eqs. (7) and (8) respectively, where k 1 (min −1 ) and k 2 (L μmol −1 min −1 ) are rate constants of adsorption, q t (L μmol −1 ) is the adsorption capacity at time t, q e (L μmol −1 ) is the equilibrium adsorption capacity.…”
Section: Adsorption Kineticsmentioning
confidence: 99%
“…To deal with these problems, various conventional methods have been developed to eliminate colorants from industrial effluents. They include reduction followed by chemical precipitations [8], ion exchange [9], inverse osmosis [10], coagulation and flocculation [11], oxidation or ozonation [12], membrane separation [13] and adsorption on activated commercial charcoal [14,15]. Most of these methods are however expensive, especially when applied to effluents with high flow rates or high concentration of dyes.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, the electrodeposition of copper from ammoniacal solutions onto substrates other than iron has been studied extensively. Based on thermodynamic and electrochemical studies, numerous authors agree that the electrodeposition of copper from ammoniacal solutions of different compositions occurs via the reduction of cupric tetrammine to cuprous diammine, which is then further reduced to metallic copper (Darchen et al, 1997;Giannopoulou et al, 2009;Graham et al, 2002;Grujicic and Pesic, 2005;Nila and González, 1996a;Nila and González, 1996b;Ramos et al, 2001;Vazquez-Arenas et al, 2007a;Vazquez-Arenas et al, 2007b). The direct reduction of cupric tetrammine to metallic copper is also thought to take place at more negative applied potentials (Grujicic and Pesic, 2005).…”
Section: Introductionmentioning
confidence: 99%