“…The growth conditions included a substrate temperature of 750 • C, nitrogen flow rate of 1.0 sccm, plasma forward power of 350 W, and Ga beam equivalent pressure of ∼6 × 10 −8 Torr. 13,36,37 The Ge effusion cell temperature was 1130 • C, which corresponds to Ge beam equivalent pressure (BEP) of ∼10 −11 Torr, which is similar the previous reports. 35,38 Due to the suitable atom size, Ge can be incorporated into GaN with less lattice distortion and can provide better nanowire morphology, compared to Si-doping.…”