Electrochemical techniques and their applications for CMP of metal films

Roy, D.

doi:10.1016/b978-0-12-821791-7.00009-5

Cited by 2 publications

(1 citation statement)

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“…The anode reaction is enhanced because the OH − generated by the H 2 O 2 reaction participates in the anode reaction, causing more Cu to be oxidized and generating more corrosion products. 25 The potentiodynamic polarization curves of Cu in 40 ml H 2 O 2 with different concentrations of glycine and the relevant electrochemical test parameters are shown in Fig. 4 and Table II.…”

Section: Resultsmentioning

confidence: 99%

Corrosion Inhibition and the Synergistic Effect of Three Different Inhibitors on Copper Surface

Gao

Zheng

et al. 2022

ECS J. Solid State Sci. Technol.

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Copper(Cu) has been an interconnect material widely used in giant-large scale integrated circuits (GLSI). Corrosion inhibition is a key factor to ensure global planarization of Cu in the chemical mechanical planarization slurry. Here, three selected inhibitors BTA(Benzotriazole), TAZ(1,2,4-triazole), and MBO( 2-Benzoxazolethione) were investigated for their inhibition behaviors and synergy on the Cu surface. The results show that they are all effective Cu inhibitors in alkaline solutions. MBO loses its inhibition ability in H2O2, but BTA and TAZ do not. The calculated synergistic parameters of BTA/TAZ is 0.1763, X-ray photoelectron spectroscopy, and UV-Via experiments show that the antagonism between them is caused by two competitive reactions due to the similar adsorption mechanism: one is the competition for the adsorption site on the surface, and the other is the competition of copper ions that affects the formation of Cu(I)-BTA. The calculated synergistic parameter of BTA/MBO is 1.7763, the synergy between them is obvious.

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Section: Resultsmentioning

confidence: 99%