2006
DOI: 10.1016/j.surfcoat.2006.08.128
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Electroconductive textile structures through electroless deposition of polypyrrole and copper at polyaramide surfaces

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Cited by 83 publications
(58 citation statements)
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“…This will allow us to determine the overall damage L D of the textile sheet, after each washing test (5, 15 and 25 wash cycles). To this end, use will be made of relation (6), which gives the resistor damage in terms of the instantaneous resistance and the initial resistance of the sample. We have then …”
Section: Application To Printed Circuit Onto Nonwovenmentioning
confidence: 99%
“…This will allow us to determine the overall damage L D of the textile sheet, after each washing test (5, 15 and 25 wash cycles). To this end, use will be made of relation (6), which gives the resistor damage in terms of the instantaneous resistance and the initial resistance of the sample. We have then …”
Section: Application To Printed Circuit Onto Nonwovenmentioning
confidence: 99%
“…The reaction mechanism of the polypyrrole layer formation is described in 5 and a study on the optimized chemical's concentrations is as reported in. 6 The reaction proceeded at 4 • C, because at higher temperature too many side-branches are formed disrupting the continuous film formation. At lower temperature, in turn, the reaction speed is too slow.…”
Section: A Gate Electrodementioning
confidence: 99%
“…At lower temperature, in turn, the reaction speed is too slow. 6 PPy acted as a host material for the deposition of the copper gate layer. Sensitization and activation with a tin-chloride (SnCl 2 ) -palladium-chloride (PdCl 2 ) solution was required.…”
Section: A Gate Electrodementioning
confidence: 99%
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