Electrocrystallization and electrochemical control of crystal growth: fundamental considerations and electrodeposition of metals

Abstract

The fundamental steps involved in an electrochemical reaction are reviewed with respect to their role in crystallization at the electrode surface. The reaction system is seen to be sensitive to the flow environment and the nature of the electrode surface. The electrode potential can influence many features including reaction rate, chemical and phase composition, the extent of adsorption, orientation and texture. Aspects of electrocrystallization are illustrated by considering cases of metal deposition. Particular emphasis is placed upon the development of surface roughness and the formation of metal powders during copper deposition from aqueous acid sulphate solutions.

The influence of Cu2O crystal structure on the Cu2O/ZnO heterojunction photovoltaic performance

“…Electrocrystallization is a process that produces conductive crystals from the mass transfer joined with charge transfer. Walsh and Herron [6] define the electrocrystallization as the process (or result) of a direct or indirect electrochemical influence on the crystallization, where direct influence refers to the domination of overpotential in the nucleation and growth of crystals, while indirect refers to the influence of local reaction (e.g. the pH) on the crystallization process.…”

Evolution of Morphology and Microstructure in Electrodeposited Nanocrystalline Al–Mg Alloy Dendrites

“…The high current densities at tips of feather-like morphology can generate very high local potentials. The potential (E) is directly proportional to the logarithm of current density, i.e., log(j) [25]. The high local potentials can cause nucleation events at several sites [25] resulting in fine grain size of ~16 ± 7 nm in the smooth globules (Figure 3(b) and 5(d)).…”

“…The potential (E) is directly proportional to the logarithm of current density, i.e., log(j) [25]. The high local potentials can cause nucleation events at several sites [25] resulting in fine grain size of ~16 ± 7 nm in the smooth globules (Figure 3(b) and 5(d)). This shows that an inverse relationship exists between current density and grain size of the depositing morphologies.…”

Fabrication of Ni Metal Mask by Electroforming Process Using Wetting Agents

“…It is known that electroplated metals mainly have an amorphous structure or a non-textured crystalline structure depending on the processing conditions. 8 However, a textured structure of Ni was developed when the processing variables were optimized, as shown in Table I. For all the specimens, the Ni (111) and (002) planes formed parallel to the surface of the specimens.…”