Electrode Patterning for Organic Diodes by Roll-to-Roll Processes

Lu, Chih-Chiang; Yuo, Hsin-Lin; Lin, Chang‐Yu; Hou, Jiaqi

doi:10.1109/fedc.2008.4483872

Cited by 1 publication

(1 citation statement)

References 2 publications

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“…Soft lithographic printing and transfer of photosensitive polymers: facile fabrication of free-standing structures and patterning fragile and unconventional substrates and MEMS packaging [3][4][5][6][7][8][9], roll-to-roll photolithographic processes for flexible electronics [10][11][12], micromolds as electroplating and fast prototyping masters [13][14][15][16][17], patterning on curved surfaces [18], wafer adhesive bonding [19,20], and structural materials for microfluidic chips [21][22][23][24][25]. However, the thickness of most DF PRs is 20-50 µm [26], and as the minimum feature size is closely related to the PR thickness, features smaller than 10 µm would be difficult to resolve.…”

Section: Journal Of Micromechanics and Microengineeringmentioning

confidence: 99%

Soft lithographic printing and transfer of photosensitive polymers: facile fabrication of free-standing structures and patterning fragile and unconventional substrates

Zhang¹,

Han²,

Zhu³

et al. 2014

J. Micromech. Microeng.

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Dry film photoresists (DF PRs) are widely used to perform photolithography on nontraditional substrates such as printing circuit boards, plastic sheets, or non-planar surfaces. Commercially available DF PRs are usually in a negative tone and rather thick, limiting lithographic resolution and versatility. The relatively large pressure required for lamination also prevents the technology from being used for delicate substrates. Here we present a modified soft-lithographic process, namely photoresist blanket transfer (PR BT), transferring a spin-coated PR film from a flat elastomeric stamp to a substrate. The elastomeric stamp is highly compliant, bringing the PR film into intimate contact with the substrate and eliminating the need for a large lamination pressure. Photolithography on unconventional substrates such as etched, fragile, and porous ones is demonstrated. Single or multiple transfers of PRs by BT are utilized to fabricate multilayer, free-standing, and re-entrant polymeric microstructures. A fragile and porous substrate such as an anodized aluminum oxide membrane can also be patterned using PR BT. Moreover, a reliable method to create metal electrodes and high surface area catalysts inside microchannels is discussed for novel microfluidic applications.

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