Electrodeposition of Alloys Containing Copper and the Metals of the Iron Group

Brenner, Abner

doi:10.1016/b978-1-4831-9808-8.50026-5

Cited by 6 publications

(5 citation statements)

References 12 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As a consequence, there is no displacement reaction. The alloy composition predicted by the no-corrosion model is given by ~2 f~P + i~t~ icudt [4] Xcu -…”

Section: Im = Iptp + I~t~ Tp + T; [31mentioning

confidence: 99%

Effect of Off‐Time on the Composition of Pulse‐Plated Cu‐Ni Alloys

Roy

Landolt

1995

J. Electrochem. Soc.

View full text Add to dashboard Cite

The limit of applicability of a previously developed mathematical model for the prediction of pulse-plated Cu-Ni alloys in the presence of a mass-transport controlled corrosion reaction has been investigated. The growth of a Cu-rich layer on the alloy surface, which suppresses further dissolution of nickel, has been theoretically analyzed. This model is used to compute t~r, the maximum value of off-time when nickel dissolution is governed by a mass-transfer-controlled Cu 2+ deposition reaction. Experimentally, a shift in alloy composition from the corrosion model is observed at long pulse-off times. The measured values of off-time where alloy compositions deviate from corrosion behavior concurs with the theoretically computed tcr value.

show abstract

“…As a consequence, there is no displacement reaction. The alloy composition predicted by the no-corrosion model is given by ~2 f~P + i~t~ icudt [4] Xcu -…”

Section: Im = Iptp + I~t~ Tp + T; [31mentioning

confidence: 99%

Effect of Off‐Time on the Composition of Pulse‐Plated Cu‐Ni Alloys

Roy

Landolt

1995

J. Electrochem. Soc.

View full text Add to dashboard Cite

show abstract

“…Manuscript submitted Sept. 27,1993; revised manuscript received Feb. 23,1994. This was in part Paper 213 presented at the New Orleans, LA, Meeting of the Society, Oct. [10][11][12][13][14][15]1993.…”

Section: Acknowledgmentmentioning

confidence: 99%

Effect of Corrosion on the Composition of Pulse‐Plated Cu‐Ni Alloys

Roy

Matlosz

Landolt

1994

J. Electrochem. Soc.

View full text Add to dashboard Cite

Copper and nickel are codeposited by pulse and reverse-pulse plating on a rotating cylinder cathode from a citrate bath. Polarization data for copper and nickel as well as potential transients during pulse and reverse-pulse current experiments show that displacement reactions may occur during the pulse off-time or pulse-reversal time. A mathematical model which includes this effect is developed to predict the composition of electrodeposited alloys. The model shows that copper deposits at the mass-transfer limiting current throughout the pulse-cycle while nickel is alternately deposited and dissolved during the pulse on-time and off-time (or reversal time). The alloy composition is governed by pulse parameters and the diffusion limiting current for copper deposition.Due to the importance of pulsed currents in alloy electrodeposition, 1-4 a variety of investigations have focused on determining the fundamental relationships between applied pulse-parameters, governing physical phenomena (such as reaction kinetics and hydrodynamics), and the composition of the deposit. Verbrugge and Tobias~'6 proposed a theoretical model which could be used to calculate current-voltage relationships, metal ion concentration at the cathode, and deposit composition during the electroplating of a multicomponent alloy using periodic currents. Their model included the equation of convective diffusion to describe liquid-phase mass transfer at a rotating disk, Butler-Volmer expressions to calculate the rate of chargetransfer reactions at the electrode surface, and activities of individual metals in the solid-state to compute the composition of the deposit. They investigated numerically the effect of hydrodynamics, reactant concentration, reversible potentials, and solid-state activity on the deposit composition of a Cd-Te alloy. Pesco and Cheh 7 used a treatment similar to that of Verbrugge and Tobias, except that solidstate activities were neglected. They computed the composition of Pb-Sn alloys plated at a rotating disk electrode under mixed mass-transfer and kinetic control. Ruffoni and Landolt ~ investigated experimentally the variation in the composition of Au-Cu-Cd alloys as a function of applied pulse parameters and hydrodynamics. The results were compared with the prediction of a mathematical model which took into account the kinetic behavior of the three alloy components and hydrogen. 9 More recently White and co-workers ~~ have presented a theoretical model which includes the effects of migration on ion transport and of addition agents on reaction kinetics of the depositing metals.During pulse-plating of binary a11oys, the applied current is cycled between a high and a low or zero value. At high current density, both alloying dements are reduced at the cathode, but at low current density or at the opencircuit potential the less noble metal can be selectively dissolved or displaced from the alloy by the more noble one. n46 The numerical analysis of Verbrugge and Tobias 5 has already indicated that the more noble component may contin...

show abstract

“…That is, let Metal sulfides vary enormously in their solubility in water. At room temperature K2S is soluble to approximately 50% by weight in water (1), whereas HgS is soluble to the equivalent of less than one atom of Hg per liter (2). This is reflected in the response of sulfide ion selective electrodes which display an effective potential response to * Electrochemical Society Active Member.…”

Section: X14mentioning

confidence: 99%

“…The solubility product of the metal sulfides, K~p, is given by MxSy ~-xM 2~/x+ + yS 2-Ksp = (aM2ul:~+)X(as2-) y [1] where ai is the activity of the i th species, M~S~ is in the crystalline state, and M 2y/~+ and S 2-are in the aqueous state. Free sulfide activity is constrained by the second acid dissociation constant of hydrogen sulfide,/(2 HS-~-H + + S 2-K2 = (aH+)(as2-)/aHs [2] or in alkaline environments the hydrolysis equation is given by S 2-+ H20 ~ HS-+ OH Kh = K~/K2 = (aHs-)(aoH-)/(aH2o)(as2-) [3] where…”

Section: X14mentioning

confidence: 99%