Electrodeposition of Copper from Ethylenediamine Complex Solution and Properties of Deposit.

Abstract

The throwing power of Cu( II) -ethylenediamine complex plating baths and the mechanical properties of the films obtained were investigated.The addition of ammonium sulfate and glycine was found to increase specific conductivity and polarization resistance, resulting in an increase in throwing power. The further addition of a small quantity of thiodiglycollic acid to the baths resulted in an increase in the elongation and contributed to the brighting of the films.Under suitable conditions, the films obtained were shown to have the same elongation and ultimate tensile strength as commercial high-ductile electrolytic copper films.

Electrochemistry of Copper in Aqueous Ethylenediamine Solutions

“…Since ethylenediamine can chelate and effectively stabilize both cupric and the cuprous ions in aqueous solutions, it is used as a bath additive for noncyanide alkaline electroplating of copper. [5][6][7][8] It is also widely utilized in oxidative dissolution of copper metal or oxides for removal from the sludges deposited in the secondary side of the steam generator of nuclear power plants. 9,10 Metal complexes of ethylenediamine are being investigated as potential reducing agents in electroless copper deposition.…”

Electroplating of Copper on Low Carbon Steel from Alkaline Citrate Complex Baths

“…18) The addition of ethylenediamine, glycine, and thioglycolic acid improved the elongation to 20%. 19,20) Takahashi reviewed the elongation of electroformed Cu foils. Annealed Cu foil of 20 μm thickness was 20%.…”