Electrodeposition of copper on a copper single crystal (111) face in the presence of bromide ions

Nageswar, S.

doi:10.1016/0300-9416(75)90063-2

Cited by 4 publications

(2 citation statements)

References 7 publications

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“…A deposit of triangular pyramids was observed when copper was deposited from the pure solution; as observed by earlier workers [11]. When the concentration of sulphanilamide was 10 12 tool 1 ~ the pyramids became truncated (Fig.…”

Section: Morphology 311 At 2 Ma CMsupporting

confidence: 60%

The electrodeposition of copper onto a copper single-crystal (111) plane in the presence of sulphanilamide

Subramanian

Nageswar

1981

Surface Technology

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SummaryStudies were made of copper electrodeposited onto a (111) plane of a copper single crystal from an acidic CuSO4 bath containing various concentrations of sulphanilamide. As the concentration of sulphanilamide is increased the pyramidal type of growth deposited from the pure bath changes to a layer deposit which transforms to ridges and then becomes polycrystalline at all current densities. The critical concentrations of sulphanilamide for the transitions depend on the current density.

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Section: Morphology 311 At 2 Ma CMsupporting

confidence: 60%

The electrodeposition of copper onto a copper single-crystal (111) plane in the presence of sulphanilamide

Subramanian

Nageswar

1981

Surface Technology

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“…Understanding the process of electrode reaction aids in understanding the mechanism and kinetics of electrolytic crystal growth, as the physical properties of electrodeposits depend on the process of crystals growth. [39] Thermodynamic conditions can predict whether or not the reaction will occur, while the kinetics determine the chemical reaction rates of the desired reactions and side reactions and subsequently influence the composition, structure, and properties of the reaction product. [40] As shown in Fig.…”

Section: Materials Aspectmentioning

confidence: 99%

Micro thermoelectric devices: From principles to innovative applications

Liu

Zhu

et al. 2022

Chinese Phys. B

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Thermoelectric devices (TEDs), including thermoelectric generators (TEGs) and thermoelectric coolers (TECs) based on the Seebeck and Peltier effect, respectively, are capable of converting heat directly into electricity and vice versa. Tough suffering from low energy conversion efficiency and relatively high capital cost, TEDs have found niche applications, such as the remote power source for spacecraft, solid-state refrigerators, waste heat recycling, and so on. In particular, on-chip integrable micro thermoelectric devices (μ-TEDs), which can realize local thermal management, on-site temperature sensing, and energy harvesting under minor temperature gradient, could play an important role in biological sensing and cell cultivation, self-powered Internet of Things (IoT), and wearable electronics. In this review, starting from the basic principles of thermoelectric devices, we summarize the most critical parameters for μ-TEDs, design guidelines, and most recent advances in the fabrication process. In addition, some innovative applications of μ-TEDs, such as in combination with microfluidics and photonics, are demonstrated in detail.

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Electrodeposition of copper on a copper single crystal (100) face in the presence of iodide ions

Nageswar

1977

Surface Technology

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Studies were made of copper, electrodeposited on to the (100) plane of copper from highly purified solutions of copper sulphate containing known concentrations of iodide ions. For low concentration electrolytes and at low current densities there is a decrease of distance between growth layers. At high current densities and concentrations of iodide ions, there is pitting and the surface corrodes badly.

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Electrodeposition of copper on a copper single crystal (111) face in the presence of bromide ions

Cited by 4 publications

References 7 publications

The electrodeposition of copper onto a copper single-crystal (111) plane in the presence of sulphanilamide

The electrodeposition of copper onto a copper single-crystal (111) plane in the presence of sulphanilamide

Micro thermoelectric devices: From principles to innovative applications

Electrodeposition of copper on a copper single crystal (100) face in the presence of iodide ions

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