No abstract

SummaryStudies were made of copper, electrodeposited on to the (100) plane of copper from highly purified solutions of copper sulphate containing known concentrations of iodide ions. For low concentration electrolytes and at low current densities there is a decrease of distance between growth layers. At high current densities and concentrations of iodide ions, there is pitting and the surface corrodes badly.

not Available.

No abstract

SummaryObservations were made of silver electrodeposited onto the (111) plane of a silver single crystal from a complex cyanide bath. In the presence of chloride ions the growth habit of the silver is modified for deposition at low current densities, i.e. at 2 and 5 mA cm-2. At 7.5 and 10 mA cm-2 the deposit is nodular and rough in the presence of chloride ions. At 15 mA cm-2 high chloride ion concentrations produce cathodic hydrogen evolution, resulting in a fern-like deposit.