Electrodeposition of copper on copper in the presence of dithiothreitol

Sadana, Y.N.; Nageswar, S.

doi:10.1007/bf00610814

Cited by 8 publications

(3 citation statements)

References 6 publications

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“…The morphology of electrodeposited copper from acidic baths on poly or single crystal copper electrodes with and/or without additives has been widely studied [2,18,19] and the results in this work were essentially similar. Since the concern was mainly the extraction and production of pure copper, all experiments were proceeded at the limiting current density that was determined for each solution and with time range 10 -30 minutes, so it is expected that the morphologies of electrodeposited copper must be characterized by 3-D nucleation [20].…”

Section: Morphology and Composition Analysessupporting

confidence: 63%

Electrowinning of Copper Using Rotating Cylinder Electrode Utilizing Lead Anode

Soliman¹,

El‐Moneim²

2011

ENG

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The effect of lead anode, rotating cylinder electrode (RCE), amount of 1, 2-dihydroxypropane (12-DHP), temperature and rotation on the electrowinning of copper from low concentration acidified copper sulphate solution has been investigated. Copper powder was electrodeposited onto RCE that made of pure copper. From cyclic voltammetry experiments, an empirical parameter called the departure percent, S, was obtained which may represent the stability of the organic additive in the given medium and under the experimental conditions. The inhibition percentage, P, was 0.00 -89.91% depending on the experimental variables. P was affected by temperature and mole fraction of 12-DHP, while rotation did not show any influence on it. Values of activation energy of electrodeposition process, E a , were found to be less than 28 kJ mol -1 indicating diffusion controlled process. The overall mass transfer correlations under the present conditions have been computed using the dimensional analysis method. The data were valid for 90 < Sh < 1098, 737 < Sc < 59284 and 271 < Re < 7046 and the results agreed with the previous studies of mass transfer to rotating cylinders in turbulent flow regimes. The effect of time, content of 12-DHP, temperature and the speed of rotation on the morphological changes of the electrodeposited copper powder as well as deposits composition and crystallite size have been studied. Various crystallite sizes ranged 7.1 nm -250.6 nm were obtained and characterized by EDS and XRD. Different topographs proved that the rate of copper electrodeposition increased by increasing deposition time, temperature and the speed of rotation. Also, they proved that the deposition rate decreased by adding 12-DHP to the solution. Therefore, the results obtained by SEM supported those achieved by measuring the limiting current density and follow the normal manner when organic solvents were added to the electrodeposition bath.

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Section: Morphology and Composition Analysessupporting

confidence: 63%

Electrowinning of Copper Using Rotating Cylinder Electrode Utilizing Lead Anode

Soliman¹,

El‐Moneim²

2011

ENG

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“…Electrodeposition.--A number of investigators have studied the electrodeposition of silver (113,114,115) and copper (116,117,118,119,120,121,122,123,124,125,126,127,128) using cyclic voltammetry, and potentiostatic, galvanostatic, or ac impedance techniques at stationary and rotating electrodes. Rotating electrodes are useful for studying diffusion-controlled deposition processes.…”

Section: Mechanistic Studiesmentioning

confidence: 99%

A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal Migration

Steppan

Roth

Hall

et al. 1987

J. Electrochem. Soc.

108

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This paper presents an extensive literature review and assessment of corrosion failure mechanisms encountered during accelerated tests of microelectronic devices. The failure mechanism of primary emphasis is electrolytic metal migration. The metallurgies of interest are silver, gold, copper, and aluminum. Electrochemical investigations of dendritic growth are also reviewed. Mechanistic results from the electrochemical investigations are discussed in light of the empirical results of accelerated tests.

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“…An extensive list of additives used in acid copper plating prior to 1959 can be found in the literature [5] and in the acid copper chapter in a previous edition of this book [6]. Additives covered in patents granted in recent years are listed in Table 2 [84,85,93,94], cadmium [95], casein [96], cobalt [97], dextrin [96], dimethylamino derivatives [98], disulfides [98,99], 1,8-disulfonic acid [93], disodic 3,3-dithiobispropanesulfonate [100], 4,5-dithiaoctane-l,8 disulfonic acid [93], dithiothreitol [101], ethylene oxide [100], gelatin [102], glue [76,96], gulac [76], lactose benzoylhydrazone [103], 2-mercaptoethanol [104], molasses [96], sulfonated petroleum [76], o-phenanthroline [95,105], polyethoxy ether [106], polyethylene glycol [87,107,108], polyethylene imine [107], poly N,N 0 -diethylsaphranin [100], polypropylene ether [109,110], propylene oxide [100], sugar [96], thiocarbamoyl-thio-alkane sulfonates [111], and thiourea [76,81,…”

Section: Addition Agentsmentioning

confidence: 99%

Electrodeposition of Copper

Dini

Snyder

2010

Modern Electroplating

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Polyethylene oxides, glycols, and amines U.S.5,024,736 6/18/91 Clauss et al. Disubstituted ethane sulfonic compounds U.S.4,990,224 2/5/91 Mahmoud Urea, sodium lauryl sulfate, and tosyl or mesyl sulfonic acid U.S.4,975,159 12/4/90 Dahms Alkoxylated lactam amides U.S.4,954,226 9/4/90 Mahmoud Urea and glycerin U.S.4,948,474 8/14/90 Miljkovic Alkylarylene U.S.4,897,165 1/30/90 Bernards et al. Copper/sulfuric acid ratios U.S.4,781,801 11/1/88 Frisby Polyether surfactants þ sulfurized benzene þ grain refiner U.S.4,673,467 6/16/87 Nee Polyethers þ mercaptoimidazole þ sulfurized benzene U.S.4,555,315 11/26/85 Barbieri et al. Polyethers þ organic divalent sulfur compound þ tertiary alkyl amine with polyepichlorohydrin U.S.4,551,212 11/5/85 Rao et al. Phenazine dyestuffs U.S.4,540,473 11/22/83 Bindra et al. S-containing anions other than SO 4 U.S.4,521,282 7/11/84 Tremmel Sulfamic acid U.S.4,490,220 12/25/84 Houman Nitrogen-carbon-sulfur compound U.S.4,430,173 2/7/84 Boudot et al. Sodium salt of W-sulfo-n-propyl N,N-diethyldithiocarbamate, PEG, and crystal violet U.S.4,376,685 6/24/81 Watson Alkylated polyalkyleneimine U.S.4,347,108 8/31/82 Willis Nitrogen-and sulfur-containing compounds U.S.4,336,114 6/22/82 Mayer et al. Phthalocyanine, tertiary alkyl amine with polyepichloro hydrin, polyethyleneimine U.S.4,334,966 12/2/81 Beach et al. Polyether, mercaptoimidazole, sulfurized benzene U.S.4,310,392 1/12/82 Kohl Phenolphthalein U.S.4,272,335 2/19/80 Combs Substituted phthalocyanine radical U.S.4,242,181 12/30/80 Malak Regular coffee U.S.4,134,803 1/16/79 Eckles et al. Disulfides, sulfonic acids, and aliphatic aldehyde U.S.4,110,176 8/29/78 Creutz et al.

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Electrodeposition of copper on copper in the presence of dithiothreitol

Cited by 8 publications

References 6 publications

Electrowinning of Copper Using Rotating Cylinder Electrode Utilizing Lead Anode

Electrowinning of Copper Using Rotating Cylinder Electrode Utilizing Lead Anode

A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal Migration

Electrodeposition of Copper

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