Morphology of Electrochemically and Chemically Deposited Metals 2016
DOI: 10.1007/978-3-319-26073-0_5
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Electrodeposition of Metals with Hydrogen Evolution

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Cited by 4 publications
(7 citation statements)
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“…In other electrolytes, it has been shown that metal electrodeposits can become porous due to the simultaneous evolution of H 2 bubbles during metal electrodeposition. 37 However, from the SEM images of the electrodeposits generated in this study, there is no significant evidence of high porosity, indicating that the effect of H 2 on the morphology of the electrodeposits is minimal.…”
Section: Resultsmentioning
confidence: 60%
“…In other electrolytes, it has been shown that metal electrodeposits can become porous due to the simultaneous evolution of H 2 bubbles during metal electrodeposition. 37 However, from the SEM images of the electrodeposits generated in this study, there is no significant evidence of high porosity, indicating that the effect of H 2 on the morphology of the electrodeposits is minimal.…”
Section: Resultsmentioning
confidence: 60%
“…Hydrogen bubbles, which form and adhere temporarily to the surface of the support electrode during the foaming process, serve as a dynamic template for the metal deposition. 37,46 Consequently, highly porous metal deposits are created on the substrate and, in the present case, cover concentrically the interconnected wires of the mesh support (Figure 1b). The formed catalyst/support ensemble is hereafter denoted Cufoam@mesh.…”
Section: ■ Results and Discussionmentioning
confidence: 81%
“… 37 Popov et al have indicated that these effects can lead to a substantial increase in the limiting current for the metal deposition as a mechanistic prerequisite for the actual metal-foaming process. 46 For an estimation of the Nernst diffusion layer thicknesses and corresponding achievable limiting currents, we refer to the discussion of Figure S17 in the Supporting Information.…”
Section: Resultsmentioning
confidence: 99%
“…A magnetic stirring was performed to expel bubbles generated from hydrogen evolution reaction and speed up the ionic migration. [45,46] As the plating continued, Co was deposited onto the LIG matrix from the edge to the middle (Figure S2, Supporting Information) due to the higher cathode current concentrated on the margins. [45] The non-uniform current distribution would also cause a thicker Co layer on the margins.…”
Section: Electroplating Co Layer Onto Ligmentioning
confidence: 99%
“…[45,46] As the plating continued, Co was deposited onto the LIG matrix from the edge to the middle (Figure S2, Supporting Information) due to the higher cathode current concentrated on the margins. [45] The non-uniform current distribution would also cause a thicker Co layer on the margins. After 180 s, the sensing area of LIG was completely covered by a grey Co layer (Figure 3a).…”
Section: Electroplating Co Layer Onto Ligmentioning
confidence: 99%