Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3

Tseng, Yu-Chen; Lee, Hsuan; Hau, Nga Yu; Feng, Shien‐Ping; Chen, Chih‐Ming

doi:10.1007/s11664-017-5777-1

Cited by 7 publications

(3 citation statements)

References 29 publications

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“…First, for the Bi 2 Te 3 -based TE module, the interfacial reactions include the reaction of the Ni barrier layer with the solder layer and the reaction of Ni with the TE leg. According to previous studies, 29,30 it was reported that the formation rate of the Ni 3 Sn 4 reactive layer between Ni and the solder layer is about 5 μm/1000 h at a temperature of 200 °C. The generation rate of the reactive layer between Ni and the ptype thermoelectric leg at a temperature of 250 °C is about 0.4 μm/day, and it is 0.9 μm/day for the n type.…”

Section: Basic Assumptionsmentioning

confidence: 96%

Interfacial Crack Growth-Based Fatigue Lifetime Prediction of Thermoelectric Modules under Thermal Cycling

Zhang,

He,

Niu

et al. 2023

ACS Appl. Mater. Interfaces

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As a result of the complexity and difficulty of the lifetime assessment of the thermoelectric (TE) module, the related research is still immature. In this work, to predict the lifetime of the Bi 2 Te 3 -based TE module from the perspective of cyclic thermal stress leading to interface cracking, the viscoplastic behavior of the solder layer is first described by the Anand material ontology model, and then the sprouting and expansion of interface cracking of the module are simulated by combining the Darveaux model and the viscoplastic dissipation energy accumulated during the thermal stress cyclic loading. After that, the complete lifetime prediction model of the TE module is established on the basis of the thermal cycling experiments and the finite element simulation calculation data, which can simply and efficiently predict the cycle number of the module resistance rise and its rise rate. The prediction deviations are 6.1 and 6.7%, respectively, verifying the feasibility of the model. The work in this paper can provide a reference for the life evaluation of TE modules.

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Section: Basic Assumptionsmentioning

confidence: 96%

Interfacial Crack Growth-Based Fatigue Lifetime Prediction of Thermoelectric Modules under Thermal Cycling

Zhang,

He,

Niu

et al. 2023

ACS Appl. Mater. Interfaces

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show abstract

“…The design of TEG can usually be categorized into in-plane and cross-plane structures [26]. Many works have been reported on cross-plane bismuth telluride based thin film through electrodeposition [27], screen printing [28], brush-painting [29,30] and inkjet printing [31]. In comparison, an in-plane TEG structure is mechanically stronger and more flexible and conformable over a hot surface [32][33][34][35].…”

Section: Toc Graphics Introductionmentioning

confidence: 99%

Wearable and flexible thin film thermoelectric module for multi-scale energy harvesting

Karthikeyan

Surjadi

Wong

et al. 2020

Journal of Power Sources

100

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Developing a thermoelectric generator(TEG) with shape conformable geometry for sustaining low-thermal impedance and large temperature gradient (∆ ) is fundamental for wearable and multi-scale energy harvesting applications. Here we demonstrate a flexible architectural design, with efficient thin film thermoelectric generator as a solution for this problem. This approach not only decreases the thermal impedance but also multiplies the temperature gradient, thereby increasing the power conversion efficiency (PCE) as comparable to bulk TEG. Intact thin films of Tin telluride (p-type) and Lead Telluride (n-type) are deposited on flexible substrate through physical vapor deposition and a thermoelectric module possessing a maximum output power density of 8.4mW/cm 2 is fabricated. We have demonstrated the performance of p-SnTe/n-PbTe based TEG as a flexible wearable power source for electronic gadgets, as a thermal touch sensor for real-time switching and temperature monitoring for exoskeleton applications.

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“…Ni can both improve the bonding strength between solder and substrate and block the diffusion of solder to the substrate. [26][27][28][29][30] In addition, the interfacial products formed by Ni and Bi 2 Te 3 -based TE materials are mostly binary Ni x Te y intermetallic compounds (such as NiTe, 31,32 NiTe 2, 32,33 Ni 3 Te 2,…”

Section: Introductionmentioning

confidence: 99%

Preparation and Characterization of Ni/Bi0.5Sb1.5Te3 Heterogeneous Multilayered Thermoelectric Materials

Guo

Zhu

Lin

et al. 2019

Journal of Elec Materi

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It is difficult to achieve coordinated optimization in thermoelectric materials due to the strong coupling between the electrical and thermal transport properties. However, interface effects, especially those caused by heterogeneous interfaces, are promising to overcome this challenge. In this work, the Ni/Bi 0.5 Sb 1.5 Te 3 (BST) heterogeneous multilayer structure thermoelectric materials were fabricated by the combination of vacuum evaporation deposition and spark plasma sintering. The influence of Ni layer on the phase composition, microstructure and thermoelectric performance along the different directions (0°, 30°, 60°and 90°, the angles between the performance measurement direction and the Ni layer) of Ni/BST materials were systematically investigated. The microstructural analysis indicates that the distinct heterogeneous interfaces were firmly bonded, and the interface reaction layer was composed of Ni and Te. As compared with the matrix, the electrical conductivity and Seebeck coefficient of the Ni/BST heterogeneous multilayer thermoelectric materials increased, and the thermal conductivity slightly reduced. For Ni/BST90°sample, the maximum ZT value of 1.05 was achieved at 370 K, increased by 19.1% compared with the BST90°. Our work demonstrates that the electron and phonon transport properties can be simultaneously optimized by introducing the ordered heterogeneous interfaces.

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Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3

Cited by 7 publications

References 29 publications

Interfacial Crack Growth-Based Fatigue Lifetime Prediction of Thermoelectric Modules under Thermal Cycling

Interfacial Crack Growth-Based Fatigue Lifetime Prediction of Thermoelectric Modules under Thermal Cycling

Wearable and flexible thin film thermoelectric module for multi-scale energy harvesting

Preparation and Characterization of Ni/Bi0.5Sb1.5Te3 Heterogeneous Multilayered Thermoelectric Materials

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