Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.
DOI: 10.1109/isapm.2005.1432052
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Electrodeposition of polyurethane adhesive for MEMS application

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“…Different from the similar polyurethane adhesive electrodeposition process that Wang et al (2005) introduced, the adhesive in this case is deposited on pre structured electrodes, without a mould made of photoresist.…”
Section: Adhesive Deposition In Batch Technologymentioning
confidence: 99%
See 1 more Smart Citation
“…Different from the similar polyurethane adhesive electrodeposition process that Wang et al (2005) introduced, the adhesive in this case is deposited on pre structured electrodes, without a mould made of photoresist.…”
Section: Adhesive Deposition In Batch Technologymentioning
confidence: 99%
“…The picture on the right shows larger test structures while the images on the left show an 18 lm wide adhesive line (5 lm insulation opening) and a spot with 14 lm diameter (4 lm opening) and 5 lm thickness. This process method is more similar to the one of Wang et al (2005), but goes without preparing and removing a photoresist form. The insulator can remain on the substrate.…”
Section: Adhesive Deposition In Batch Technologymentioning
confidence: 99%