Electrodeposition of Thin Films and Multilayers on Silicon

Pasa, A. A.; Schwarzacher, Walther

doi:10.1002/(sici)1521-396x(199905)173:1<73::aid-pssa73>3.0.co;2-8

Cited by 72 publications

(35 citation statements)

References 14 publications

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“…The electrodeposition of thin films and multilayers of the metals Cu, Co and Ni directly on the surface of ntype silicon substrates were studied by Pasa and Schwarzacher [116]. Different aqueous electrolytes containing sulphates or sulphamates of the metals and supporting additives were used.…”

Section: Electrodeposition Of Multilayersmentioning

confidence: 99%

Recent developments in the electrodeposition of nickel and some nickel-based alloys

Oriňáková¹,

Turoňová²,

Kladeková³

et al. 2006

J Appl Electrochem

222

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The numerous theoretical and practical studies of the electrodeposition of nickel and its binary and selected ternary alloys with copper and cobalt over the last 10-15 years are reviewed. The reported mechanisms of the electrodeposition processes and accompanying evolution of hydrogen are considered. The complex influence of different bath compositions, pHs, current densities or potential ranges and temperature on the formation of single or multiple deposition layers are compared. The determination of the structure and morphology of the deposits on different substrates, including solid surfaces and particulate materials, using a range of analytical techniques are reported.

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Section: Electrodeposition Of Multilayersmentioning

confidence: 99%

Recent developments in the electrodeposition of nickel and some nickel-based alloys

Oriňáková¹,

Turoňová²,

Kladeková³

et al. 2006

J Appl Electrochem

222

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“…For plain magnetic layers with very small Ohmic resistance the substrate leakage current is negligible and magnetoresistance measurements can be performed. 28 However, for patterned magnetic layers such as the inverse sphere magnetic antisphere arrays shown in Fig. 5 the resistance is substantially higher and suppression of leakages becomes paramount.…”

Section: -3mentioning

confidence: 99%

Orientation and symmetry control of inverse sphere magnetic nanoarrays by guided self-assembly

Kiziroglou

Gonzalez

et al. 2006

Journal of Applied Physics

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Inverse sphere shaped Ni arrays were fabricated by electrodeposition on Si through the guided self-assembly of polystyrene latex spheres in Si/ SiO 2 patterns. It is shown that the size commensurability of the etched tracks is critical for the long range ordering of the spheres. Moreover, noncommensurate guiding results in the reproducible periodic triangular distortion of the close packed self-assembly. Magnetoresistance measurements on the Ni arrays were performed showing room temperature anisotropic magnetoresistance of 0.85%. These results are promising for self-assembled patterned storage media and magnetoresistance devices.

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“…For the experiments described in this paper, the electrical contact to the wafer is made through contacts along the circumference on the wafer (peripheral contact), see figure 2. In order to avoid significant resistance to the current and to provide a uniform current distribution, the sheet resistance (R ) should be low, typically under 0.5 per square [5]. In the case of a wafer with a 0.01 µm Cr adhesion layer and a 0.1 µm thick Au conducting layer on top, this resistance is about 0.2 per square (table 2).…”

Section: Theoretical Considerationsmentioning

confidence: 99%

Seedless electroplating on patterned silicon

Llona¹,

Jansen²,

Elwenspoek³

2006

J. Micromech. Microeng.

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Nickel thin films have been electrodeposited without the use of an additional seed layer, on highly doped silicon wafers. These substrates conduct sufficiently well to allow deposition using a peripherical electrical contact on the wafer. Films 2 µm thick have been deposited using a nickel sulfamate bath on both n+-and p+-type silicon wafers, where a series of trenches with different widths had been previously etched by plasma etching. A new, reliable and simple procedure based on the removal of the native oxide layer is presented which allows uniform plating of patterned substrates.

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Electrodeposition of Thin Films and Multilayers on Silicon

Cited by 72 publications

References 14 publications

Recent developments in the electrodeposition of nickel and some nickel-based alloys

Recent developments in the electrodeposition of nickel and some nickel-based alloys

Orientation and symmetry control of inverse sphere magnetic nanoarrays by guided self-assembly

Seedless electroplating on patterned silicon

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