Electrodeposition of tin from a sulphate bath. An EQCM study

Collazo, A.; Figueroa, R.; Nóvoa, X.R.; Pérez, C.

doi:10.1016/j.surfcoat.2015.08.052

Cited by 16 publications

(15 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[4] In recent years, the electrodeposition of Sn has received considerable attention due to its non-toxicity, high resistance to corrosion, good ductility and its potential for use in electrochemical applications such as electronics and batteries. [5][6][7][8][9] Sn and its alloy coatings have been used in numerous industrial applications such as the automobile industry, [10] microelectronics, [11] aeronautics, [12] and the food industry. [13] Sn and its alloys have been widely used for imparting corrosion resistance to active metal substrates in aggressively corrosive environments.…”

Section: Introductionmentioning

confidence: 99%

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Alesary¹

2019

International Journal of Electrochemical Science

View full text Add to dashboard Cite

A number of studies into the influence of additives on the electrodeposition of metals from aqueous solution have been reported in the literature. However, very few have studied the influence of additives on metal electrodeposition in Deep Eutectic Solvents (DESs). This work will show, for the first time, the effect of sodium bromide on the electrodeposition of tin, copper, silver and nickel from a deep eutectic solvent (DES)-based ionic liquid consisting of a stoichiometric 1:2 mix of choline chloride and ethylene glycol (Ethaline 200). It is shown that in the presence of sodium bromide, bright and smooth Cu and Ni deposits were formed. Cyclic voltammetry and chronocoulometry have been used to examine the electrochemical properties of the plating liquids in both the absence and presence of sodium bromide. It was found that the redox peak currents of the Sn and Ag electrolytes get smaller when sodium bromide is added to the electrolyte solution. The resultant surface morphologies, topography and roughness of Sn, Cu, Ag and Ni were investigated by scanning electron microscopy (SEM/ EDXS) and 3D optical microscopy (3D). The current efficiency of metal deposits was found to increase when the deposition was achieved from an electrolyte that contained sodium bromide.

show abstract

Section: Introductionmentioning

confidence: 99%

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Alesary¹

2019

International Journal of Electrochemical Science

View full text Add to dashboard Cite

show abstract

“…1 Furthermore, tin and its alloys have been used as: anodic materials in lithium and sodium-42 K E S R I , AFFOUNE and DJAGHOUT -ion batteries, [2][3][4][5] semiconductor materials in solar cells, 6 photocatalysts for photodegradation of organic compounds 7 and as a catalyst for methanol oxidation in fuel cells. 8 Electrodeposition of tin and its alloys is generally carried out using sulphate or chloride based stannous baths, in acidic [9][10][11][12][13][14][15][16][17][18][19][20][21] or alkaline 22,23 media. In literature, other types of baths such as: fluoroborates, 24 pyrophosphates 2,25 and methanosulfonates 26,27 have been also reported.…”

Section: Introductionmentioning

confidence: 99%

Effects of thiourea on the kinetics and electrochemical nucleation of tin electrodeposition from stannous chloride bath in acidic medium

Kesri¹,

Affoune²,

Djaghout³

2019

JSCS

View full text Add to dashboard Cite

The effects of thiourea (TU) on the kinetics and electrochemical nucleation of tin from stannous chloride bath in acidic medium have been investigated by cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS) and chronoamperometry. CV results showed that the tin reduction is a one-step reaction and indicated that TU inhibited the reduction of tin ions at high concentration. EIS analysis showed that the electrodeposition process of tin is affected by the addition of TU. The nucleation mechanism of tin was studied using both Sharifker-Hills (SH) and Palomar-Pardavé (PP) models. SH model indicated that hydrogen evolution and tin reduction occurred simultaneously. Non-dimensional current-time transients curves based on PP model revealed that the tin nucleation followed 3D progressive mechanism without TU and with 0.01 M TU, while the nucleation process changes to 3D instantaneous in presence of 0.1 M TU. However, at 1 M TU, the nucleation mechanism is located between instantaneous and progressive model. The proton reduction reaction was inhibited at all concentrations of TU. Quantitative determination showed that in the presence of TU, the diffusion coefficient of tin species, the hydrogen evolution rate constant, the nucleation rate constant and the number of active sites were decreased.

show abstract

“…Partly due to the reason that, inorganic metals results in complexes that are toxic and uncontrolled used of such inorganic complexes may result in the suppression of some biological processes [4]. On the other hand, the most commonly encountered acidic electroplating tin chemistry is based on the utilization of fluoboric acid [5], sulfuric acid [6], phenol sulfonic acid (PSA)/halogen electrolyte [7, 8], hydrochloric/hydrofluoric acid and methane sulfonic acid (MSA) [9].…”

Section: Introductionmentioning

confidence: 99%

Determination of optimal conditions for electrodeposition of Tin(II) in the presence of Alizarin Red S

Ali

Amaniampong²,

Karam

2016

Heliyon

View full text Add to dashboard Cite

A detailed physicochemical properties of aqueous solutions of alizarin red S − tin (II) chloride, has been thoroughly investigated by extensively exploring the effect of pH, concentration and temperature on the optimal conditions for the formation of tin (II)-alizarin red S (ARS-Sn II) complex. UV-Vis spectra, electrical conductivity and pH method were also used to characterize the final product. The stoichiometry of the reaction complex formation was determined via different referential methods. It was observed that, the reaction complex was formed when the concentrations were smaller than a certain limit (10−5 M). Adjusting the pH of the reaction (typically from 3.7 to 6.0) also resulted in the formation of the complex. The formed complex was highly stable in dark conditions (absence of sunlight) and at ambient temperature. Without the use of additives and by employing the investigated optimal conditions (i.e. pH: 5.0, i: 6 mA/cm2, t: 5 min, C: 0.1 M, d: 1.273 × 10−4 cm), electrodeposition of tin (II) was demonstrated to be successful.

show abstract

Electrodeposition of tin from a sulphate bath. An EQCM study

Cited by 16 publications

References 32 publications

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Effects of thiourea on the kinetics and electrochemical nucleation of tin electrodeposition from stannous chloride bath in acidic medium

Determination of optimal conditions for electrodeposition of Tin(II) in the presence of Alizarin Red S

Contact Info

Product

Resources

About