Electrodeposition Study of Ni Coatings on Copper from Choline Chloride-Based Deep Eutectic Solvents

Abstract

Nickel was electrodeposited from choline chloride (ChCl)-based deep eutectic solvents (DESs) containing ethylene glycol (EG) and urea (U) on Cu substrate. The influence of the temperature and of DESs nature was evaluated. The diffusion coefficients of nickel varied from 2.2 × 10 −9 to 3.7 × 10 −8 cm 2 s −1 for ChCl:2U and from 1.3 × 10 −8 to 5.8 × 10 −8 cm 2 s −1 for ChCl:2EG with increasing temperature. The nucleation process of Ni on Cu at 70 °C was determined as instantaneous in ChCl:2EG and progressive in ChCl:2U using Scharifker and Hills model. The SEM characterization showed that with increasing temperature, more compact coatings were obtained. Linear polarization and electrochemical impedance spectroscopy were used to evaluate the corrosion performance of the obtained deposits in 3.5% NaCl. The coatings were more protective as higher the temperature of deposition, with polarization resistance (R p) values from 3.53 to 19.11 kΩ cm 2 .

Ni/cerium Molybdenum Oxide Hydrate Microflakes Composite Coatings Electrodeposited from Choline Chloride: Ethylene Glycol Deep Eutectic Solvent

“…The magnitude of impedance |Z| increased during exposure (Figure 7a), which may indicate increasing corrosion resistance, due to the formation of, e.g., a stable passive layer or increasing diffusion constrains (especially after 144 and 168 hours). A similar shape of impedance spectra and similar tendency (increasing) for the impedance modulus have been observed in previous work by Urcezino et al [37] and J. Winiarski et al [38].…”

Electrochemical Behavior and Electronucleation of Copper Nanoparticles from CuCl2·2H2O Using a Choline Chloride-Urea Eutectic Mixture

“…DESs have received much attention for metals electrodeposition applications (i.e., Ni, Fe, Al, and Zn [12][13][14][15][16]) due to several advantages, such as a wide electrochemical window, low cost, ease of preparation, negligible vapor pressure, thermal stability, and (nearly) null hydrogen liberation during electrodeposition [17,18], compared to conventional aqueous solvents. Particularly, in the case of copper, although the copper electrodeposition from DESs has been reported in the literatures [19,20], insights on the early stages of this process, specifically, mechanistic and kinetic aspects, are still limited.…”

Influence of bath composition on the electrodeposition of amorphous Ni‐Mo alloys using potassium‐sodium tartrate as complexing agent

“…Other works for Mo electrodeposition performed at the same temperature condition are reported in the literature. [34,35] All deposits were obtained in quiescent conditions. Depositions were complete at an electric charge of 300 C.…”