Electroformed conductor patterns in electronics manufacturing

Abstract

Purpose -The aim of this study was to test and survey a circuitry transfer technique where conductor patterns are electroformed on carrier substrates and thereafter the electroformed patterns are transferred from carrier substrates to their final devices. Design/methodology/approach -An electrically conductive pattern is built up by an electrodepositing metal or metal alloy on a carrier substrate, called a mandrel, using a resist image to define the outlines of the pattern. Thereafter, the electroformed structures are bonded on plastic substrates, for instance, by hot pressing or by embedding into a resin. In our experiments, the imaging of stainless steel carriers was done by the photolithographic process and the electroformed copper patterns were transferred by hot pressing onto thermoplastic substrates. Findings -The literature review revealed that the transfer of electroformed conductor patterns to plastic parts is not a very commonly used technology, although it could provide possibilities for even quite specific structures in electronics manufacturing at an affordable price. Our tests indicated that the acidic peroxide-sulfuric pre-treatment of electroformed copper patterns before hot press bonding clearly improved the adhesion of copper on both acrylonitrile butadiene styrene and polyphenylene oxide substrates and that a steel template around the substrate during hot pressing process can restrict dimensional changes in thermoplastic substrates significantly. Originality/value -This paper contains a survey and preliminary testing of the electroformed circuitry transfer technique. The analysis of the test boards focused on the adhesion between copper strips and thermoplastic substrates and on the factors affecting adhesion. Finally, the paper introduces the advantages and drawbacks of the technique.

Additive Fabrication of Conductive Patterns by a Template Transfer Process Based on Benzotriazole Adsorption As a Separation Layer

“…Teija Laine-Ma, etc., reported a transfer process to additively fabricate embedded copper patterns in a thermoplastic substrate for 3D circuitries . Electroplated copper film shows poor adhesion on a stainless steel surface for the passivation layer on the steel surface.…”

“…Teija Laine-Ma, etc., reported a transfer process to additively fabricate embedded copper patterns in a thermoplastic substrate for 3D circuitries. 24 Electroplated copper film shows poor adhesion on a stainless steel surface for the passivation layer on the steel surface. Based on this mechanism, copper was electroplated on steel carrier foil with a plating resistant mask to form the designed patterns, followed by dissolution of the mask.…”