Electroforming

Hart, Tony; Watson, Alec

doi:10.1016/s0026-0576(00)80348-7

Cited by 18 publications

(10 citation statements)

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“…[1][2][3][4][5]. Some of them are functionalized in the form of a seamless hollow cylinder like nickel rotary screen and filter sieve [6]. Normally, such a perforation cylinder is fabricated by the subtractive process, i.e., removing materials from the given blank metallic cylinder and the micro-perforations are formed one by one.…”

Section: Introductionmentioning

confidence: 99%

Facile Fabrication of Highly Perforated Hollow Metallic Cylinder with Changeable Micro-Orifices by Electroforming-Extrusion Molding Hybrid Process

et al. 2020

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A seamless thin-walled hollow metallic cylinder with array of micro-perforations is one of the key components for some products. Normally, these micro-perforations are formed by removing material from the given metallic hollow cylinder (pipe or tube) one by one or row by row. To efficiently and flexibly manufacture such a highly perforated hollow cylinder, this paper proposed a hybrid technique combining extrusion moulding process and electroforming process. In the hybrid technique, the extrusion moulding process was used to create polymer extrusion patterns on the outside surface of the given stainless steel (SS) pipe, and then the electroforming process was carried out using the SS pipe as the mandrel. The formation of the polymer extrusion patterns was simulated and extruding molding experiments were carried out to examine the feasibility of the various mandrels. Electroforming experiments were implemented to verify the achievement of the seamless perforated thin-walled hollow cylinder. It was found that five different types of polymer extrusion pattern were able to be obtained on the same extruding pipe just by adjusting some extruding conditions and parameters, and correspondingly four types of perforated hollow cylinder with different tapered orifices are produced after the electroforming process. The obtainable perforations are: perforation with double conic-orifices, perforation with hemispheric orifice and conic orifice, unidirectionally tapered perforation, and straight-walled perforation. The geometric profile of the extrusion patterns is highly dependent on the processing conditions and parameters. The proposed hybrid process represents a promising alternative process to fabricate seamless thin-walled perforated hollow metallic cylinder efficiently, flexibly, and with low cost.

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Section: Introductionmentioning

confidence: 99%

Facile Fabrication of Highly Perforated Hollow Metallic Cylinder with Changeable Micro-Orifices by Electroforming-Extrusion Molding Hybrid Process

et al. 2020

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“…Now nickel electroforming has been employed in fabricating precision dies, rocket engine thrust chamber, shaped charge liner, and other special structure parts [1][2][3][4]. However, there are some drawbacks in the traditional electroforming process, such as pinholes, pits and nodules.…”

Section: Introductionmentioning

confidence: 99%

Effects of Attrition on Microstructure of Electroformed Nickel

Zhang¹,

Zhang²,

Li³

2015

Proceedings of the 5th International Conference on Advanced Design and Manufacturing Engineering

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Abstract:The nickel deposits of different microstructures were obtained by electroforming with abrasive-assisted, .The effects of friction strength on the surface morphology and the microstructures of the deposits were studied. The results indicate that the deposits with homogeneous microstructures were obtained with the horizontal cathode, during the abrasive-assisted electroforming process of nickel. The surface smoothness was improved and the nickel crystal grain was refined with the increasing linear velocity. The nickel deposits could be obtained with a wide range of microstructures at different speed of the rotating cathode, which the grain size was in the range from 100nm to 600nm. The difference value of growth rate of the various crystal faces is getting smaller with the increasing velocity of the cathode.

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“…An expendable carrier material provides opportunities for very special shapes of EF structure, for instance, an EF structure can contain pipes and channels in its structure. Aluminum is a carrier material, which can readily be dissolved in a sodium hydroxide solution and expendable thermoplastic carriers can be dissolved in solvents (ASTM B 832-93, 1998;Hart and Watson, 2000).…”

Section: Introductionmentioning

confidence: 99%

Electroformed conductor patterns in electronics manufacturing

et al. 2014

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Purpose -The aim of this study was to test and survey a circuitry transfer technique where conductor patterns are electroformed on carrier substrates and thereafter the electroformed patterns are transferred from carrier substrates to their final devices. Design/methodology/approach -An electrically conductive pattern is built up by an electrodepositing metal or metal alloy on a carrier substrate, called a mandrel, using a resist image to define the outlines of the pattern. Thereafter, the electroformed structures are bonded on plastic substrates, for instance, by hot pressing or by embedding into a resin. In our experiments, the imaging of stainless steel carriers was done by the photolithographic process and the electroformed copper patterns were transferred by hot pressing onto thermoplastic substrates. Findings -The literature review revealed that the transfer of electroformed conductor patterns to plastic parts is not a very commonly used technology, although it could provide possibilities for even quite specific structures in electronics manufacturing at an affordable price. Our tests indicated that the acidic peroxide-sulfuric pre-treatment of electroformed copper patterns before hot press bonding clearly improved the adhesion of copper on both acrylonitrile butadiene styrene and polyphenylene oxide substrates and that a steel template around the substrate during hot pressing process can restrict dimensional changes in thermoplastic substrates significantly. Originality/value -This paper contains a survey and preliminary testing of the electroformed circuitry transfer technique. The analysis of the test boards focused on the adhesion between copper strips and thermoplastic substrates and on the factors affecting adhesion. Finally, the paper introduces the advantages and drawbacks of the technique.

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Electroforming

Cited by 18 publications

References 0 publications

Facile Fabrication of Highly Perforated Hollow Metallic Cylinder with Changeable Micro-Orifices by Electroforming-Extrusion Molding Hybrid Process

Facile Fabrication of Highly Perforated Hollow Metallic Cylinder with Changeable Micro-Orifices by Electroforming-Extrusion Molding Hybrid Process

Effects of Attrition on Microstructure of Electroformed Nickel

Electroformed conductor patterns in electronics manufacturing

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