Electroforming of 3D microstructures on highly structured surfaces

Johansen, Leif Steen; Ginnerup, Morten; Ravnkilde, Jan Tue; Tang, Peter Torben; Löchel, Bernd

doi:10.1016/s0924-4247(00)00346-0

Cited by 17 publications

(6 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…To handle this problem much effort was spent in developing of an electro deposited photo resist process. The resist chosen 6 was originally intended to be used for printed circuit board lithography, but it has also been used for three-dimensional pattering of anistropically etched silicon structures [13], [14]. Exposure of the resist was done with a mask aligner 7 equipped with special optics which enables high resolution (depth of focus) over large topographies.…”

Section: ) Patterningmentioning

confidence: 99%

Elastomer chip sockets for reduced thermal mismatch problems and effortless chip replacement, preliminary investigations

Norberg¹,

Dejanovic²,

Hesselbom

2003

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

To avoid the problem with thermo-mechanical stress induced fatigue using conventional flip-chip mounting of bare chips, an elastic chip socket has been developed.The socket is made by casting silicone elastomer into micro structured silicon molds to form micro bump arrays. After the elastomer is cured and released from the mold, a metal layer is deposited and patterned.A chip is placed in the socket utilizing guiding structures for chip self alignment. The chip is then held in place by a spring loaded back-plate which can also serve as a heat sink for highly effective chip cooling. Since no adhesives, underfills or solders are used, the rework process becomes very simple and it can also be repeated many times for the same socket. Initial contact resistance and thermo-mechanical robustness measurements indicates that this type of sockets could work as a superior replacement for conventional flip-chip technologies in many applications. The particular design of the contact bumps results in metal structures that resemble (although up side down) and are scalable as those in the Chip-First technology.Preliminary thermal shock experiments from room temperature to liquid nitrogen and back show good survival. Thus, this new chip interconnect method indicates the possibility of getting the advantages of the Chip-First technology while eliminating the demand of placing the chip first. The concept will work for chips with rim positioned pads as well as for high density area arrays.

show abstract

Section: ) Patterningmentioning

confidence: 99%

Elastomer chip sockets for reduced thermal mismatch problems and effortless chip replacement, preliminary investigations

Norberg¹,

Dejanovic²,

Hesselbom

2003

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

show abstract

“…Many groups have successfully transferred a wide variety of patterns to both 2-D [2-17] and 3-D [3,7,8,[18][19][20][21][22][23][24][25][26][27] substrates using microcontact printing. Some innovative 2-D applications resulted in a variety of end uses.…”

Section: Background: Microcontact Printing Has Been Used In a Wide Vamentioning

confidence: 99%

Exploring the Feasibility of Fabricating Micron-Scale Components Using Microcontact Printing LDRD Final Report

Myers¹,

Ritchey²,

Stokes³

et al. 2003

View full text Add to dashboard Cite

Many microfabrication techniques are being developed for applications in microelectronics, microsensors, and micro-optics. Since the advent of microcomponents, designers have been forced to modify their designs to include limitations of current technology, such as the inability to make three-dimensional structures and the need for piece-part assembly. Many groups have successfully transferred a wide variety of patterns to both two-dimensional and three-dimensional substrates using microcontact printing. Microcontact printing is a technique in which a self-assembled monolayer (SAM) is patterned onto a substrate by transfer printing. The patterned layer can act as an etch resist or a foundation upon which to build new types of microstructures. We created a gold pattern with features as small as 1.2 µm using microcontact printing and subsequent processing. This approach looks promising for constructing single-level structures such as microelectrode arrays and sensors. It can be a viable technique for creating three-dimensional structures such as microcoils and microsprings if the right equipment is available to achieve proper alignment, and if a means is available to connect the final parts to other components in subsequent assembly operations. Microcontact printing provides a wide variety of new opportunities in the fabrication of microcomponents, and increases the options of designers.4

show abstract

“…In particular, the integration of sensor and actuator elements on surfaces with high aspect ratio microstructures has become of interest, but developments have been limited due to the difficulties that arise in photolithography on such surfaces. 10,11 As an alternative to this, Kutchoukov et al developed a two-step spin coating procedure for conformal coating on ͑100͒ silicon with KOH etched through holes and cavities. These parameters are difficult to control if surface topography of tens to hundreds of microns is present on the substrate surface, which is not uncommon in MEMS fabrication.…”

Section: Introductionmentioning

confidence: 99%

Spreading of thin-film metal patterns deposited on nonplanar surfaces using a shadow mask micromachined in Si (110)

Tiggelaar

Berenschot

Elwenspoek

et al. 2007

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

View full text Add to dashboard Cite

show abstract

Electroforming of 3D microstructures on highly structured surfaces

Cited by 17 publications

References 4 publications

Elastomer chip sockets for reduced thermal mismatch problems and effortless chip replacement, preliminary investigations

Elastomer chip sockets for reduced thermal mismatch problems and effortless chip replacement, preliminary investigations

Exploring the Feasibility of Fabricating Micron-Scale Components Using Microcontact Printing LDRD Final Report

Spreading of thin-film metal patterns deposited on nonplanar surfaces using a shadow mask micromachined in Si (110)

Contact Info

Product

Resources

About