Electroforming

Hart, Tony; Watson, Alec

doi:10.1016/s0026-0576(01)85299-5

Cited by 7 publications

(5 citation statements)

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“…[7] EF Ni shows excellent strength, toughness, and ductility and is extremely resistant to corrosion in a wide range of environments. [8] Nickel also shows high corrosion resistance in molten chloride as well as in molten fluoride [9] and is regularly employed at elevated temperature [10] as the NiO saturated film developed was not expected to dissolve and provide good corrosion resistance. [11] Arons et al [12] reported that tungsten is the only material known to be capable of withstanding the corrosive attack of a wide range of liquid metals.…”

Section: Introductionmentioning

confidence: 99%

Corrosion and Microstructure Correlation in Molten LiCl-KCl Medium

Shankar

Mathiya²,

Thyagarajan

et al. 2010

Metall Mater Trans A

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Pyrochemical reprocessing in molten chloride salt medium has been considered as one of the best options for the reprocessing of spent metallic fuels of future fast breeder reactors. The unit operations such as salt preparation, electrorefining, and cathode processing involve the presence of molten LiCl-KCl eutectic salt from 673 to 1373 K (400 to 1100°C). The present work discusses the corrosion behavior of electroformed nickel (EF Ni) without and with nickel-tungsten (Ni-W) coating, 316L SS, and INCONEL 625 alloy in molten LiCl-KCl eutectic salt at 673 K, 773 K, and 873 K (400°C, 500°C, and 600°C) in the presence of air. The weight percent loss of the exposed samples was determined by the weight loss method and surface morphology of the salt exposed, and product layers were examined by scanning electron microscopy (SEM). X-ray diffraction (XRD) and energy-dispersive X-ray (EDX) analysis were also carried out on the exposed and corrosion product layers to understand the phases present and the corrosion mechanism involved. The results of the present study indicated that INCONEL 625 alloy showed superior corrosion resistance compared to electroformed nickel (EF Ni), EF Ni with nickel-tungsten (Ni-W) coating (EF Ni-W), and 316L SS. The EF Ni with Ni-W coating exhibits better corrosion resistance than EF Ni without tungsten coating. Based on the surface morphology, XRD, and EDX analysis of corrosion product layers, the mechanism of corrosion of INCONEL 625 and 316L involves formation of chromium-rich compound at the surface and subsequent spallation. For the EF Ni, the porous thick NiO corrosion product allows the penetration of salt, thus accelerating the corrosion. Improved corrosion resistance of EF Ni-W was attributed to the W-rich NiO layer, while for INCONEL 625, the adherent and protective NiO layer improved the corrosion resistance. The article highlights the results of the present investigation.

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Section: Introductionmentioning

confidence: 99%

Corrosion and Microstructure Correlation in Molten LiCl-KCl Medium

Shankar

Mathiya²,

Thyagarajan

et al. 2010

Metall Mater Trans A

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“…This involves multiple working processes and can, therefore, be very costly as well as inefficient in terms of energy consumption. However, the production of thin layers and mesh products is by far the biggest industrial use of electroforming [64,65]. Different stent strut thicknesses have been reported in literatures from 75 to 200 μm [66].…”

Section: Fabrication Process For Biodegradable Stentsmentioning

confidence: 99%

Biodegradable Metals for Cardiovascular Stent Application: Interests and New Opportunities

Moravej

Mantovani

2011

IJMS

530

319

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During the last decade, biodegradable metallic stents have been developed and investigated as alternatives for the currently-used permanent cardiovascular stents. Degradable metallic materials could potentially replace corrosion-resistant metals currently used for stent application as it has been shown that the role of stenting is temporary and limited to a period of 6–12 months after implantation during which arterial remodeling and healing occur. Although corrosion is generally considered as a failure in metallurgy, the corrodibility of certain metals can be an advantage for their application as degradable implants. The candidate materials for such application should have mechanical properties ideally close to those of 316L stainless steel which is the gold standard material for stent application in order to provide mechanical support to diseased arteries. Non-toxicity of the metal itself and its degradation products is another requirement as the material is absorbed by blood and cells. Based on the mentioned requirements, iron-based and magnesium-based alloys have been the investigated candidates for biodegradable stents. This article reviews the recent developments in the design and evaluation of metallic materials for biodegradable stents. It also introduces the new metallurgical processes which could be applied for the production of metallic biodegradable stents and their effect on the properties of the produced metals.

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“…An expendable carrier material provides opportunities for very special shapes of EF structure, for instance, an EF structure can contain pipes and channels in its structure. Aluminum is a carrier material, which can readily be dissolved in a sodium hydroxide solution and expendable thermoplastic carriers can be dissolved in solvents (ASTM B 832-93, 1998; Hart and Watson, 2000).…”

Section: Introductionmentioning

confidence: 99%

Electroformed conductor patterns in electronics manufacturing

et al. 2014

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Purpose -The aim of this study was to test and survey a circuitry transfer technique where conductor patterns are electroformed on carrier substrates and thereafter the electroformed patterns are transferred from carrier substrates to their final devices. Design/methodology/approach -An electrically conductive pattern is built up by an electrodepositing metal or metal alloy on a carrier substrate, called a mandrel, using a resist image to define the outlines of the pattern. Thereafter, the electroformed structures are bonded on plastic substrates, for instance, by hot pressing or by embedding into a resin. In our experiments, the imaging of stainless steel carriers was done by the photolithographic process and the electroformed copper patterns were transferred by hot pressing onto thermoplastic substrates. Findings -The literature review revealed that the transfer of electroformed conductor patterns to plastic parts is not a very commonly used technology, although it could provide possibilities for even quite specific structures in electronics manufacturing at an affordable price. Our tests indicated that the acidic peroxide-sulfuric pre-treatment of electroformed copper patterns before hot press bonding clearly improved the adhesion of copper on both acrylonitrile butadiene styrene and polyphenylene oxide substrates and that a steel template around the substrate during hot pressing process can restrict dimensional changes in thermoplastic substrates significantly. Originality/value -This paper contains a survey and preliminary testing of the electroformed circuitry transfer technique. The analysis of the test boards focused on the adhesion between copper strips and thermoplastic substrates and on the factors affecting adhesion. Finally, the paper introduces the advantages and drawbacks of the technique.

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Electroforming

Cited by 7 publications

References 0 publications

Corrosion and Microstructure Correlation in Molten LiCl-KCl Medium

Corrosion and Microstructure Correlation in Molten LiCl-KCl Medium

Biodegradable Metals for Cardiovascular Stent Application: Interests and New Opportunities

Electroformed conductor patterns in electronics manufacturing

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