Electroless Deposition of Palladium and Platinum

Ohno, Izumi

doi:10.1002/9780470602638.ch20

Cited by 6 publications

(3 citation statements)

References 30 publications

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“…Studies on electroless platinum deposition or plating baths often utilize hydrazine as the reducing agent. 5,6 The platinum deposits obtained from hydrazine plating baths had excellent purity, however, aside from the discernable odor, hydrazine has been proven harmful to the human body. 7 Alternatively, autocatalytic platinum plating with sodium borohydride (SBH) as a reducing agent has been reported.…”

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confidence: 99%

Stabilization of an Electroless Platinum Plating Bath Using S-Bearing Additives

Mizuhashi

Cordonier

Honma

et al. 2015

J. Electrochem. Soc.

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Moderation of an electroless platinum plating bath by thiol, thioether, disulfide, thiocarbonyl, thiosulfate and sulfide compounds was investigated. The inhibitory effect of stabilizers on catalyzed anodic oxidation of the reducing agent used, sodium borohydride, on platinum surfaces was electrochemically characterized by linear sweep voltammetry. Catalytic oxidation inhibition was found to correlate with chemisorption dynamics to catalytic sites on the platinum surface and the steric structure of the sulfur in the compound. Evaluation of the compounds as moderators in electroless plating revealed that the deposition rate and bath stability correlated with the sodium borohydride oxidation inhibition character. Tiopronin had a moderate inhibitory effect on catalytic sodium borohydride oxidation and functioned as an effective stabilizer in the electroless platinum plating bath. Based on the correlation, an inhibitor concentration optimization method using anodic polarization curves was established. The dynamics of the electroless plating reaction concurred with electrochemical analysis and was comprehensively described by the mixed potential theory. Using cyclic voltammetry, the deposits had similar electrochemical characteristic to that of pure polycrystalline platinum, although less than 0.5 wt% sulfur inclusion was confirmed by elemental analysis. Platinum has unique and exploitable physical and chemical properties such as corrosion resistance, thermal stability and catalytic activity for various chemical reactions. This noble metal has been widely used in various fields, functioning as catalyst, especially in autocatalysis and fuel cells, as a sensor material and as an electrode material. Electroless deposition of nanostructured platinum for application as an electrocatalyst has also been studied.2,3 However, there are few reports in the scientific literature on the electroless plating bath itself. This may be because electroless deposition of platinum is more difficult to control than that of other noble metals such as gold or palladium. 4 Electroless plating has been used to functionalize the surface of a material and has the potential to enable fabrication of many kinds of device. Therefore a deeper understanding of electroless platinum plating may provide fabrication tools for applications not currently feasible.Studies on electroless platinum deposition or plating baths often utilize hydrazine as the reducing agent. 5,6 The platinum deposits obtained from hydrazine plating baths had excellent purity, however, aside from the discernable odor, hydrazine has been proven harmful to the human body.7 Alternatively, autocatalytic platinum plating with sodium borohydride (SBH) as a reducing agent has been reported. 8,9 In these studies, sulfur compounds such as rhodanine (Figure 1) 8 and thiols like trithiocyanuric acid 9 had been used as stabilizers of the plating bath. However, the stabilization mechanism of the sulfur compounds and identification of effective structures and optimal parameters remains unclear. ...

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confidence: 99%

Stabilization of an Electroless Platinum Plating Bath Using S-Bearing Additives

Mizuhashi

Cordonier

Honma

et al. 2015

J. Electrochem. Soc.

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“…reagent, Sigma-Aldrich). DI water is the standard solvent used in most electroless deposition processes since it is a very good polar solvent [31]. Also in this case DMSO was chosen instead of DI water as an alternative solvent because of its lower surface tension that allows a better infiltration into the porous layer.…”

Section: Methodsmentioning

confidence: 99%

Palladium nanoparticle deposition via precipitation: a new method to functionalize macroporous silicon

Scheen

Bassu

Douchamps

et al. 2014

Science and Technology of Advanced Materials

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We present an original two-step method for the deposition via precipitation of Pd nanoparticles into macroporous silicon. The method consists in immersing a macroporous silicon sample in a PdCl2/DMSO solution and then in annealing the sample at a high temperature. The impact of composition and concentration of the solution and annealing time on the nanoparticle characteristics is investigated. This method is compared to electroless plating, which is a standard method for the deposition of Pd nanoparticles. Scanning electron microscopy and computerized image processing are used to evaluate size, shape, surface density and deposition homogeneity of the Pd nanoparticles on the pore walls. Energy-dispersive x-ray spectroscopy (EDX) and x-ray photoelectron spectroscopy (XPS) analyses are used to evaluate the composition of the deposited nanoparticles. In contrast to electroless plating, the proposed method leads to homogeneously distributed Pd nanoparticles along the macropores depth with a surface density that increases proportionally with the PdCl2 concentration. Moreover EDX and XPS analysis showed that the nanoparticles are composed of Pd in its metallic state, while nanoparticles deposited by electroless plating are composed of both metallic Pd and PdOx.

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“…This showed good selectivity and control of the deposition of these metals in a regular nanoscale array. The ELD process could be applied to a wide range of metals including Pd, , Pt, Ni, , and Co , as the process is controlled by the difference in reduction potential between Si and the metal ions in the solution.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and Growth Control of Metal Nanostructures through Exploration of Atomic Force Microscopy-Based Patterning and Electroless Deposition Conditions

et al. 2020

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Applications such as biosensing, plasmonics, and nanoelectronics require nanoscale metal structures with controlled dimensions and placement. However, significant challenges remain in the fabrication of metal nanostructures of controlled size, shape, and placement on a solid support. Among these challenges are precise positional control at the nanoscale, flexibility and tunability in shape, and the cost and complexity of methods. This work presents the development and exploration of methods for the fabrication of copper, silver, and gold (Cu, Ag, and Au) nanostructures directly on silicon (Si) substrates through the use of atomic force microscopy (AFM)-based nanofabrication using a self-assembled monolayer (SAM) resist followed by metal deposition in the structure using electroless deposition (ELD). The importance of the role of the SAM resist layer is highlighted, as it is critical to prevent metal deposition on the areas of the substrate outside the desired pattern. We have found that octadecyltrichlorosilane (OTS) monolayers are much more robust and resistant films for the ELD process than either octadecyl SAMs, formed from alkenes on hydrogen-terminated Si, or octadecyldimethylchlorosilane (ODMS) SAM films. In addition, the patterning parameters used for the AFM-based fabrication, the ELD solution parameters, and the role of doping of Si have been explored and together the results suggest that with proper tuning of the ELD solution concentrations and the use of a robust SAM resist film, such as OTS, tunable metal nanostructures are achievable. This is demonstrated here for Cu, Ag, and Au, but the process should be adaptable to a variety of metals, as long as the redox potentials are compatible with the oxidation of Si. Importantly, this method exploits the exquisite tunability of AFM-based lithography to provide precise control over the size, shape, and position of the metal nanostructure. This provides significant advantages for prototyping of new structures, as well as fundamental investigations of the properties of such nanostructures.

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Electroless Deposition of Palladium and Platinum

Cited by 6 publications

References 30 publications

Stabilization of an Electroless Platinum Plating Bath Using S-Bearing Additives

Stabilization of an Electroless Platinum Plating Bath Using S-Bearing Additives

Palladium nanoparticle deposition via precipitation: a new method to functionalize macroporous silicon

Fabrication and Growth Control of Metal Nanostructures through Exploration of Atomic Force Microscopy-Based Patterning and Electroless Deposition Conditions

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