Electroless metallization of sic after laser ablation

Shafeev, G. A.; Bellard, L.; Themlin, J.‐M.; Ammar, C. Fauquet‐Ben; Cros, A.; Marine, W.

doi:10.1016/0257-8972(95)02717-3

Cited by 12 publications

(2 citation statements)

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“…Polyimide is known to be a high-performance organic dielectric material with good thermal stability, chemical resistivity, and excellent mechanical properties, and has thus been widely used in microelectronics device fabrication and packaging (1,2). Polyimide metallization is increasingly required in many applications (3)(4)(5)(6). Various methods have been developed for this purpose, and among them, selective electroless deposition (ELD) has emerged as an appealing patterning technique in which the metal is electrolessly plated onto a pre-established pattern (7)(8)(9)(10).…”

Section: Introductionmentioning

confidence: 99%

Selective Electroless Deposition Using Photoinduced Oxidation of Sn(II) Compounds on Surface-Modified Polyimide Layers

et al. 2007

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This paper describes an electroless deposition method for fabricating microscale metal patterns on polyimide surfaces. This method uses the selective deposition of catalytic Pd seeds via the photoinduced oxidation of Sn(II) compounds. The preparation process requires three steps: a first step in which the adsorption of Sn(II) compounds occurs on the surface of the polyimide film through ion exchange reactions, a second step in which the photoinduced oxidation of the Sn(II) compounds with atmospheric oxygen occurs in ultraviolet light (UV) irradiated areas, and a third step comprising the deposition of Pd2+ ions in non-irradiated areas, which are simultaneously reduced.

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Section: Introductionmentioning

confidence: 99%

Selective Electroless Deposition Using Photoinduced Oxidation of Sn(II) Compounds on Surface-Modified Polyimide Layers

et al. 2007

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“…The adhesion of electroless deposited metal films, especially noble metal films, to ceramic substrates is generally poor. [1][2][3][4][5][6][7] Improved adhesion is usually achieved by surface roughening of the substrate using a chemical or mechanical etching process so as to increase the effective area upon which the van der Waals force can act. However, due to the inherent difficulty of controlling the etching conditions, inadequate surface roughness is usually obtained, which limits the adhesive strength of the metal deposits.…”

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confidence: 99%

Adhesion of Electroless Deposited Cu on ZnO‐Coated Glass Substrates: The Effect of the ZnO Surface Morphology

Sun

Tryk

Hashimoto

et al. 1999

J. Electrochem. Soc.

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ZnO thin films with various surface morphologies were prepared on glass substrates by spray pyrolysis, and the influence of the morphology on the adhesion of the electroless deposited Cu films was investigated. Results showed that the adhesive strength of the electroless Cu deposits was greatly affected by the surface morphology of the ZnO thin films, which can be controlled by changing the preparation parameters, e.g., substrate temperature, precursor solution composition, and spray time. Cu deposits with high adhesion false(>2.5 normalkg/mm2false) were achieved on ZnO thin films with rougher, more porous morphologies. The latter were mainly composed of small ball‐like structures, with diameters on the order of 0.2–1.0 μm. Upon electroless Cu deposition on these ZnO films, in addition to the strong van der Waals force acting at the Cu/ZnO interface caused by the large surface area on a rough, porous surface, the Cu penetrates deeply into the film, giving rise to a strong mechanical, anchoring effect (“dovetail” or ball‐and‐socket joint effect), which also greatly improves adhesive strength. Such porous structures, which are difficult to obtain by chemical etching of the substrate in the conventional electroless metal deposition process, were obtained by spraying 0.05 M zinc acetate/ethanol solution onto glass substrates at temperatures above 380°C. © 1999 The Electrochemical Society. All rights reserved.

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Activation and Metallization of Dielectrics

Körber¹

Excimer Laser Technology

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Electroless metallization of sic after laser ablation

Cited by 12 publications

References 5 publications

Selective Electroless Deposition Using Photoinduced Oxidation of Sn(II) Compounds on Surface-Modified Polyimide Layers

Selective Electroless Deposition Using Photoinduced Oxidation of Sn(II) Compounds on Surface-Modified Polyimide Layers

Adhesion of Electroless Deposited Cu on ZnO‐Coated Glass Substrates: The Effect of the ZnO Surface Morphology

Activation and Metallization of Dielectrics

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