Electroless nickel plating from acid bath

Małecki, Andrzej; Micek‐Ilnicka, A.

doi:10.1016/s0257-8972(99)00423-5

Cited by 85 publications

(44 citation statements)

References 2 publications

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“…Obviously, phosphorous fraction decreases with the increase of Ce concentration in the plating solutions. Main competitive oxidation-reduction reaction in the acidic hypophosphite plating bath can be expressed as [19]:…”

Section: Methodsmentioning

confidence: 99%

Effects of rare earth cerium addition on the synthesis and corrosion resistance of electroless Ni–PTFE–P coating

Liu

Zhou²,

et al. 2010

Materials & Corrosion

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Electroless Ni-PTFE-P coatings have been successfully deposited on the surface of mild steel shaft from plating baths containing various concentrations of rare earth metal cerium (RE Ce). Surface morphology, Ce fraction, and thickness of the coatings were characterized by scanning electron microscope, inductively coupled plasma optical emission spectrometry, and reflection optical microscope, respectively. Salt spray test was used to determine the corrosion resistance of the coating. Results revealed that structure, compactness, and deposition rate of the Ni-PTFE-P coatings were increased significantly by addition of a small amount of RE Ce (10-20 ppm) to the plating bath. Electroless Ni-PTFE-P coating deposited from plating baths with 20 ppm Ce shows the highest corrosion resistance, owing to its high compactness and thickness. Deposition rate and corrosion resistance of the Ni-PTFE-P coating were deteriorated greatly as concentration of RE Ce in the plating baths exceeds 100 ppm.

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Section: Methodsmentioning

confidence: 99%

Effects of rare earth cerium addition on the synthesis and corrosion resistance of electroless Ni–PTFE–P coating

Liu

Zhou²,

et al. 2010

Materials & Corrosion

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“…For example sodium salt and to choice buffering agent depends on pH range used. For pH adjustment such as sulphuric and hydrochloric acids, soda ammonia [7,17,23].…”

Section: Stabilizermentioning

confidence: 99%

“…The properties of electroless nickel are depending on the quantity of phosphorus in the chemical solution [6,17]. Generally, electroless plating process comprising a source of metal ions, complexing agent, reducing agent, stabilizer, buffering agent, wetting agent, controlled pH and temperature [6,7] as represented in Table 2.…”

Section: A Introductionmentioning

confidence: 99%

Electroless and Immersion Plating Process towards Structures and IMC Formation

Adawiyah¹,

Azlina²,

Fadil³

et al. 2016

IJET

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Abstract-The selection of surface finish on printed circuit board is very important in soldering process because it can prevent the copper from oxidation and provide solderable surface. It is also will influence the cost, manufacturing, shelf life, surface quality, final product reliability and environment.Electroless and immersion plating process has now become an important and popular surface finish in electronic industry due to simple and low cost process. The application of electroless plating are widely used in electronic industry, however it also was used in various industries such as aerospace, automotive, oil and gas, chemical processing where the need on the complex shape, homogeneous and uniform layer are required. Besides, every surface finish has their strength and weakness. Immersion silver is one of the surface finishes frequently used on the printed circuit board due to their characteristics such as good solderability and wettability, easy assembly and low cost. Both of these two processes were acts as barrier layer between copper substrate and solder balls. This review was discussed about electroless nickel and immersion silver plated on copper substrate, coating process and parameters involved. The topic also covered include the morphology and thickness of the intermetallics formed during soldering as well as the isothermal aging process.

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“…21 However, some studies recently indicated that a highly concentrated nickel bath can decrease the deposition rate. [22][23][24] A number of researchers have all concluded that the rate of deposition increases with an increase in hypophosphite concentration, pH, or temperature, but decreases with increasing complexing agents' concentration. 11,14,21,23 However, most researchers had just described the dependence of rate on various parameters, and not focused on the dynamic equations.…”

Section: Introductionmentioning

confidence: 99%

“…[22][23][24] A number of researchers have all concluded that the rate of deposition increases with an increase in hypophosphite concentration, pH, or temperature, but decreases with increasing complexing agents' concentration. 11,14,21,23 However, most researchers had just described the dependence of rate on various parameters, and not focused on the dynamic equations. 11,14,25,26 Based on a previously proposed mechanism, Malecki et al derived an empirical deposition rate equation in an acid EN plating bath, which agreed well with the experimental results.…”

Section: Introductionmentioning

confidence: 99%

Dynamic behavior of electroless nickel plating reaction on magnesium alloys

Xie

et al. 2011

J Coat Technol Res

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In order to obtain better control over the quality of electroless nickel-phosphorous (EN) coatings on magnesium AZ91D alloy, the effects of metal salt concentrations, reducing agent, pH, and temperature on deposition rate were studied. The reaction orders and activation energy of the deposition were determined. The results show that the apparent activation energy (E a ) in the EN plating reaction is approximately 38.03 kJ/mol. The deposition rate increased with increasing temperature, concentration of H 2 PO 2 À , and pH, and decreased with increasing concentration of complexing agents. For nickel ions, the deposition rate increased gradually with increasing concentration (x) when x < 4.69 g/L. However, it decreased when the concentration exceeded 4.69 g/L. Finally, various types of the deposition reaction were also discussed. The results indicate that nickel was first deposited by replacement deposition in the initial 0.5 min, then by both replacement deposition and autocatalytic deposition in plating, and finally by autocatalytic deposition after 5 min of plating.

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Electroless nickel plating from acid bath

Cited by 85 publications

References 2 publications

Effects of rare earth cerium addition on the synthesis and corrosion resistance of electroless Ni–PTFE–P coating

Effects of rare earth cerium addition on the synthesis and corrosion resistance of electroless Ni–PTFE–P coating

Electroless and Immersion Plating Process towards Structures and IMC Formation

Dynamic behavior of electroless nickel plating reaction on magnesium alloys

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