Electromigration-induced failure of metallic thin films due to transgranular void propagation

Gungor, M. Rauf; Maroudas, Dimitrios

doi:10.1063/1.121663

Cited by 61 publications

(29 citation statements)

References 16 publications

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“…For a more realistic description of the islands, especially at low temperature, anisotropy should also be included. 4,28,35 Indeed, it was already shown experimentally that extremely anisotropic properties (such as diffusion) could lead to very different behavior. In general the entries apply to both atom and vacancy islands.…”

Section: Summary and Perspectivesmentioning

confidence: 99%

Electromigration of single-layer clusters

Pierre-Louis

Einstein

2000

Phys. Rev. B

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Single-layer atom or vacancy clusters in the presence of electromigration are studied theoretically assuming an isotropic medium. A variety of distinctive behaviors distinguish the response in the three standard limiting cases of periphery diffusion (PD), terrace diffusion (TD), and evaporationcondensation (EC). A general model provides power laws describing the size dependence of the drift velocity in these limits, consistent with established results in the case of PD. The validity of the widely used quasistatic limit is calculated. Atom and vacancy clusters drift in opposite directions in the PD limit but in the same direction otherwise. In absence of PD, linear stability analysis reveals a new type of morphological instability, not leading to island break-down. For strong electromigration, Monte Carlo simulations show that clusters then destabilize into slits, in contrast to splitting in the PD limit. Electromigration affects the diffusion coefficient of the cluster and morphological fluctuations, the latter diverging at the instability threshold. An instrinsic attachment-detachment bias displays the same scaling signature as PD in the drift velocity.olivier.pierre

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Section: Summary and Perspectivesmentioning

confidence: 99%

Electromigration of single-layer clusters

Pierre-Louis

Einstein

2000

Phys. Rev. B

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“…Investigating this phenomena is complicated by the exceedingly rapid evolution and thermal runaway that occur when the neck is narrower than about 20 nm [28][29][30][31][32][33][34][35][36][37], and by the variation in grain structure for different wires [38]. The current density at failure J F has been reported to both increase [39] and decrease [37] as the wire widths decrease.…”

Section: Prl 100 056805 (2008) P H Y S I C a L R E V I E W L E T T Ementioning

confidence: 99%

Real-Time TEM Imaging of the Formation of Crystalline Nanoscale Gaps

et al. 2008

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“…due to less fast-diffusion area [7], most interconnects finally undergo electromigration failure due to voids having evolved into transgranular slits [8,9]: this experimental evidence justifies the assumption that the interconnects in this study have Not all voids, however, evolve into the shape of a slit. From the experiments of other researchers, it is known that most voids are not semicircular but have straight surfaces with characteristic angles between them, and in some systems voids have faceted or wedged shapes [10,11,12]. These various void evolutions in the single crystal are related to its crystallographic anisotropy.…”

Section: Introductionmentioning

confidence: 95%

A phase field model for electromigration-induced surface evolution

et al. 2003

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In this study, a phase field model is presented to study the effects of electromigration on the surface evolution of single crystal Al metal interconnects. Two dimensional computer simulations are performed for the surface evolution of metal interconnects due to electromigration in various conditions, such as anisotropy in diffusivity, different initial void sizes, and different crystallographic directions compared to the direction of the ambient electric field. From the results of computer simulations, it may be seen that the types of anisotropy and the relative direction of the diffusivity are the decisive factors in motion and shape change. As the symmetry of anisotropy in diffusivity decreases, the void evolves into a more unstable shape. Moreover, the voids of the system with two-fold diffusion symmetry are most likely to evolve into slits when the crystallographic direction is toward a specific orientation compared to the direction of the ambient electric field.

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Electromigration-induced failure of metallic thin films due to transgranular void propagation

Cited by 61 publications

References 16 publications

Electromigration of single-layer clusters

Electromigration of single-layer clusters

Real-Time TEM Imaging of the Formation of Crystalline Nanoscale Gaps

A phase field model for electromigration-induced surface evolution

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