A two-step, chlorination/alkylation procedure has been used to convert the surface Si-H bonds on NH 4 F ͑aq͒ -etched ͑111͒-oriented Si wafers into Si-alkyl bonds of the form Si-C n H 2nϩ1 (nу1). The electrical properties of such functionalized surfaces were investigated under high-level and low-level injection conditions using a contactless rf apparatus. The charge carrier recombination velocities of the alkylated surfaces were Ͻ25 cm s Ϫ1 under high-level and low-level injection conditions, implying residual surface trap densities of Ͻ3ϫ10 9 cm Ϫ2 . Although the carrier recombination velocity of hydrogen-terminated Si͑111͒ surfaces in contact with aqueous acids is Ͻ20 cm s Ϫ1 , this surface deteriorates within 30 min in an air ambient, yielding a high surface recombination velocity. In contrast, methylated Si͑111͒ surfaces exhibit low surface recombination velocities in air for more than 4 weeks. Low surface recombination velocities were also observed for Si surfaces that had been modified with longer alkyl chains.