Electron microscope study of electrodeposited Ni films in the 0.1–50 μ range

Abstract

Structural changes in the thin film–thick film transition of Ni, electrodeposited onto polycrystalline copper substrates, were observed. Nickel was plated onto electropolished substrates from a Watts bath held at 50 °C at a current density of 1 mA/cm2. The Cu substrates, chemically stripped from the thick Ni deposits, were subsequently electrolytically thinned to prepare transmission electron microscope (TEM) specimens. Scanning electron microscope (SEM) observations were made on the Ni deposits before stripping. Epitaxial growth was observed in deposits of 0.1-μ thickness, with traces of polycrystallinity. Deposits acquired a relatively uniform polycrystalline grain structure at about 5-μ thickness, and only slight increases in grain size were observed with increased thickness above 5 μ.

Structural characterization of electrodeposited nanophase Ni–Cu alloys

“…Twinning on the nanocrystalline scale in fcc phases has also been observed in some previous studies. 36,37 The propensity for twinning was more prevalent in larger crystals and, to a lesser extent, in the smaller crystals.…”

Effect of Substrate Etching on Electrical Properties of Electrochemically Deposited CuO

“…22,23 Different methods have been used for substrate cleaning such as chemical etching, 22,24,25 plasma etching, 26 and electrochemical etching. 22,[27][28][29][30] Electrochemical etching can be performed in situ in the deposition solution or ex situ in a different solution from the deposition solution. in situ electrochemical etching is desirable because it generates a cleaner surface without any air exposure of the cleaned substrate before deposition.…”

“…in situ electrochemical etching is desirable because it generates a cleaner surface without any air exposure of the cleaned substrate before deposition. A few papers have reported in situ electrochemical etching of substrate, 27,30 but there has been no report on in situ electrochemical etching of Cu substrate and its effect on the electrical properties of electrochemically deposited CuO films.…”