2005
DOI: 10.1016/j.susc.2005.03.053
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Electron-stimulated desorption from an unexpected source: Internal hot electrons for Br–Si(100)-(2×1)

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Cited by 32 publications
(31 citation statements)
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“…Trail et al [12] and Mizielinski et al [13] found that non-adiabatic dissipation of chemical energy leads to Boltzmann-like energy distributions of hot electrons above the Fermi level based on the first-principles theory. Several experiments suggest that the electronic excitation causes atomic/molecular processes such as adsorption/desorption, or molecular dissociation [14,15]. Nienhauss et al [16,17] detected electrons of kinetic energy greater than 0.5 eV injected into their diode when hydrogen or oxygen atoms adsorbed on silver thin film Schottky diodes.…”
Section: Introductionmentioning
confidence: 99%
“…Trail et al [12] and Mizielinski et al [13] found that non-adiabatic dissipation of chemical energy leads to Boltzmann-like energy distributions of hot electrons above the Fermi level based on the first-principles theory. Several experiments suggest that the electronic excitation causes atomic/molecular processes such as adsorption/desorption, or molecular dissociation [14,15]. Nienhauss et al [16,17] detected electrons of kinetic energy greater than 0.5 eV injected into their diode when hydrogen or oxygen atoms adsorbed on silver thin film Schottky diodes.…”
Section: Introductionmentioning
confidence: 99%
“…6, 7, and 21͒ because Cl atoms on neighboring dimers preclude the escape of the Si bystander. However, Trenhaile et al 22,23 demonstrated that bare dimers ͑BDs͒ can be generated on a saturated surface by phonon-activated electron-stimulated desorption ͑PAESD͒ of atomic Cl. Once this occurs, the surface will etch/roughen through the conventional reactions, as shown in Fig.…”
mentioning
confidence: 99%
“…The mechanism by which Cl inserts is particularly intriguing because it requires a Si dangling bond to activate Cl 2 dissociation, with one atom tying up the dangling bond and the other inserting into a Si-Si dimer bond or backbond with 10% probability. The dangling bond sites that mediate insertion are produced by phonon-activated electron-stimulated desorption (PAESD) of Cl [7,8], and the PAESD rate limits the uptake and subsequent etching reactions. Studies of the dependence of etch rate on time, flux, and temperature reveal the kinetics and establish the insertion mechanism.…”
mentioning
confidence: 99%