2010
DOI: 10.1088/1742-6596/209/1/012046
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Electron tomography of gate-all-around nanowire transistors

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Cited by 9 publications
(6 citation statements)
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“…Note that in our sample preparation method, neither Focused Ion Beam (FIB, contamination of Ga) nor the protection layer (Pt and W, contamination of Pt, W, and C) on the interested area of SiNWs is used as compared to the conventional FIBbased sample preparation method. 20,21 SiNWs are intentionally grown at a low SiH 4 pressure in order to trigger Au diffusion during NW growth. The total growth pressure is kept at 1.1 mbar and SiH 4 with a flow of 12 SCCM is used to provide the Si precursors.…”
Section: Methodsmentioning
confidence: 99%
“…Note that in our sample preparation method, neither Focused Ion Beam (FIB, contamination of Ga) nor the protection layer (Pt and W, contamination of Pt, W, and C) on the interested area of SiNWs is used as compared to the conventional FIBbased sample preparation method. 20,21 SiNWs are intentionally grown at a low SiH 4 pressure in order to trigger Au diffusion during NW growth. The total growth pressure is kept at 1.1 mbar and SiH 4 with a flow of 12 SCCM is used to provide the Si precursors.…”
Section: Methodsmentioning
confidence: 99%
“…Tomography of GAA wires showed noticeable interface roughness in the gate oxide layer (~3 nm HfO2). 18 Three-dimensional memory architectures, such as Intel's and Micron's 3D-XPoint phase-change memory, are already commercially available with high-density, low-latency bit storage. In current phase-change memory, pinning due to device inhomogeneity causes partial or stuck phase switching that limits cycle life.…”
Section: Materials Application: Semiconductorsmentioning
confidence: 99%
“…Electron optics are much more efficient and allow for high spatial resolution: sub-nanometer resolution is possible today and atomic distribution can be recovered (Scott et al, 2012). The 3D extension of electron microscopy is an invaluable technique for 3D nanoimaging (Andersson et al, 2009; Midgley & Dunin-Borkowski, 2009; Cherns et al, 2010; Haberfehlner et al, 2012). Although the principle is similar to that of X-ray imaging, there are some substantial differences.…”
Section: Optimal Specimen Shape In Tomographymentioning
confidence: 99%
“…The extraction of a single, isolated chunk that includes a single copper TSV or a single copper pillar must be performed using FIB (Lombardo et al, 2012). The standard lift-out technique (Giannuzzi et al, 2005; Shearing et al, 2009; Cherns et al, 2010) can then be used. After a precise location of the area of interest, the first step consists of depositing a protective layer made of platinum or tungsten.…”
Section: Sample Preparationmentioning
confidence: 99%