Electronic–photonic convergence for silicon photonics transmitters beyond 100 Gbps on–off keying

Li, Ke; Liu, Shenghao; Thomson, David J.; Zhang, Weiwei; Yan, Xingzhao; Meng, Fanfan; Littlejohns, Callum G.; Du, Han; Banakar, Mehdi; Ebert, Martin; Cao, Wei; Tran, D. T.; Chen, Bigeng; Shakoor, Abdul; Petropoulos, P.; Reed, Graham T.

doi:10.1364/optica.411122

Cited by 57 publications

(30 citation statements)

References 8 publications

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“…16 The current highest reported data rates of 100 Gb∕s using OOK modulation were also demonstrated in carrier depletion modulators. 122,123 Carrier depletion phase shifters exhibit a relatively limited capacitance of 0.2 to 0.8 pF∕mm 21,91 and, hence, a limited modulation efficiency. In order to improve the modulation efficiency, the capacitance can be increased by either shrinking the mode size (determined by the waveguide geometry) or by reducing the width of the depletion region (higher transition capacitance).…”

Section: High-speed Modulators Using the Plasma Dispersion Effectmentioning

confidence: 99%

“…Table 2 also presents the best-reported results for the modulation efficiencies, losses, data rates, and energy consumption. There is an interplay of a vast pool of variables, such as junction type and its actuation mechanism, doping concentrations (typically ranging from ∼10 17 to ∼10 18 cm −3 ) and their positions, Carrier depletion e ∼2 (0.52 9 ) 10 to 30 (2.6 10 ) >1 >40 (100 122,123 ) ∼200 for MZMs (32.4 19 ), <40 for RMs (0.9 18 )…”

Section: High-speed Modulators Using the Plasma Dispersion Effectmentioning

confidence: 99%

“…5,[7][8][9][10][11][12][13][14][15][16][17][18][19]22,32,33,37,[61][62][63][64][65][66][67][68][69][69][70][71] Plasma dispersion modulators in SiPh have successfully demonstrated operations of 90 (Ref. 87) and 100 Gb∕s 122,123 for the on-off keying (OOK) modulation scheme. Furthermore, various plasma dispersion modulators implementations for advanced modulation schemes such as QPSK, 55,56,124 QAM, 125,126 PAM-4, 29,52,127 and PAM-8 115 also exist.…”

Section: Introductionmentioning

confidence: 99%

“…2,122,210 In the early years, most of the high-speed modulator demonstrations focused on the optimization of modulator performance in isolation from the driver design. 122 Recent demonstrations of high-speed modulators have established that concurrent co-design and co-optimization of electrical driving and photonic phase shifter design 25,52,122 are a key to extracting the best performance for all modulator performance attributes. 52,213 This holds for modulators involving monolithic or hybrid integration with electronics.…”

Section: Introductionmentioning

confidence: 99%

“…52,213 This holds for modulators involving monolithic or hybrid integration with electronics. 25,122,213 This paper aims to provide a comprehensive review of the new technologies that provide additional, viable routes to enhance the performance of SiPh modulators. These new technologies involve the integration of materials with high electro-optic coefficients with SiPh platforms.…”

Section: Introductionmentioning

confidence: 99%

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Taking silicon photonics modulators to a higher performance level: state-of-the-art and a review of new technologies

et al. 2021

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Optical links are moving to higher and higher transmission speeds while shrinking to shorter and shorter ranges where optical links are envisaged even at the chip scale. The scaling in data speed and span of the optical links demands modulators to be concurrently performant and cost-effective. Silicon photonics (SiPh), a photonic integrated circuit technology that leverages the fabrication sophistication of complementary metal-oxide-semiconductor technology, is well-positioned to deliver the performance, price, and manufacturing volume for the high-speed modulators of future optical communication links. SiPh has relied on the plasma dispersion effect, either in injection, depletion, or accumulation mode, to demonstrate efficient high-speed modulators. The high-speed plasma dispersion silicon modulators have been commercially deployed and have demonstrated excellent performance. Recent years have seen a paradigm shift where the integration of various electro-refractive and electro-absorptive materials has opened up additional routes toward performant SiPh modulators. These modulators are in the early years of their development. They promise to extend the performance beyond the limits set by the physical properties of silicon. The focus of our study is to provide a comprehensive review of contemporary (i.e., plasma dispersion modulators) and new modulator implementations that involve the integration of novel materials with SiPh.

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Section: High-speed Modulators Using the Plasma Dispersion Effectmentioning

confidence: 99%

Section: High-speed Modulators Using the Plasma Dispersion Effectmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Taking silicon photonics modulators to a higher performance level: state-of-the-art and a review of new technologies

et al. 2021

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Fully On‐Chip Microwave Photonic Instantaneous Frequency Measurement System

Tao

Yang

Tao

et al. 2022

Laser & Photonics Reviews

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Microwave photonics (MWP) is an emerging field that studies the interaction between microwave and lightwave for myriad communication and information applications. Recently, new opportunity for MWP has emerged driven by the advances of integrated photonics. However, despite significant progress made in terms of integration level, a fully on‐chip MWP functional system comprising all the necessary photonic and electronic components, is yet to be demonstrated. Here, the status quo is broken and a complete on‐chip solution for MWP system is provided, by exploiting hybrid integration of indium phosphide, silicon photonics, and complementary metal‐oxide–semiconductor electronics platforms. Applying this hybrid integration methodology, a fully chip‐based MWP instantaneous frequency measurement (IFM) system is demonstrated. The unprecedented integration level brings great promotion to the compactness, reliability and performances of the MWP IFM system, including a wide frequency measurement range (2–34 GHz), ultralow estimation errors (10.85 MHz), and a fast response speed (≈0.3 ns). Furthermore, the chip‐scale MWP IFM system is deployed into realistic tasks, where diverse microwave signals with rapid‐varying frequencies at X‐band (8–12 GHz) are accurately identified in real‐time. This demonstration marks a milestone for the integrated MWP, by providing the technology basis for the miniaturization and massive implementations of various MWP systems.

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Co-packaged optics (CPO): status, challenges, and solutions

Tan

Liu³

et al. 2023

Front. Optoelectron.

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Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology. Graphical Abstract

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Electronic–photonic convergence for silicon photonics transmitters beyond 100 Gbps on–off keying

Abstract: We present design concepts for optical modulators without using any equalization or bespoke fabrication techniques. The demonstrated silicon photonics transmitter can operate at 100 Gbps OOK, while the power efficiency of the driver is 2.03 pJ/bit.

Cited by 57 publications

References 8 publications

Taking silicon photonics modulators to a higher performance level: state-of-the-art and a review of new technologies

Taking silicon photonics modulators to a higher performance level: state-of-the-art and a review of new technologies

Fully On‐Chip Microwave Photonic Instantaneous Frequency Measurement System

Co-packaged optics (CPO): status, challenges, and solutions

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