In the past decade, amorphous InGaZnO thin film transistors (a-IGZO TFTs) have become a very promising candidate for application in flat panel displays (FPDs). However, it is difficult to break through the mobility bottleneck of a-IGZO TFTs to obtain mobilities higher than 100 cm 2 V À1 s À1 , thus limiting their use in more advanced applications. Construction of a high-electron mobility transistor (HEMT) based on a heterojunction structure could provide a solution for this problem. In this work, the band alignment of a-IGZO and amorphous InGaMgO (a-IGMO) heterojunction has been investigated using X-ray photoelectron spectroscopy (XPS) and transmission spectra measurements. The valence band (DE V ) and conduction band offsets (DE C ) were determined as 0.09 and 0.83 eV, respectively. The DE C was large enough to construct a potential well that could favor the appearance of a twodimensional electron gas (2DEG). Hence, the achievement of an HEMT based on a-IGZO/a-IGMO heterojunction can be expected. Moreover, band bending contributed greatly to such a large DE C , and thus to the formation of electrical confinement structure. Our findings suggest that a-IGZO/a-IGMO heterojunction is a potential candidate for constructing a HEMT and thus breaking through the mobility bottleneck of a-IGZO-based TFTs for the applications in next-generation electronic products.In the past decade, a-IGZO thin film transistors (TFTs) have proven to be one of the most promising candidates for the applications in flat panel displays (FPDs) as a result of their excellent uniformity, high transparency to visible light, and large field effect mobility (m FE , over 10 cm 2 V À1 s À1 ). [1,2] Researchers have been attempting to increase the mobility m FE of a-IGZO TFTs in order to realize displays with higher resolution, faster frame rate, and larger panel size. For instance, Wu et al. [3] obtained an a-IGZO TFT with a m FE of 33.5 cm 2 V À1 s À1 by using an atmospheric-pressure-plasma-treated SiO 2 gate dielectric. The a-IGZO TFT with HfLaO gate dielectric was treated in a CHF 3 /O 2 plasma, thus increasing the m FE to an ultrahigh value of 39.8 cm 2 V À1 s À1 . [4] Recently, Zheng et al. [5] reported a highmobility a-IGZO TFT (m FE > 60 cm 2 V À1 s À1 ) with an atomic-layer-deposited SiO 2 gate insulator. Nevertheless, the m FE of a-IGZO TFTs is still not high enough, especially for satisfying some more advanced applications such as 3D displays, flexible logic circuits, and system-on-panel devices. [1] According to previous studies, an extremely high carrier mobility can be realized in the HEMT based on a heterojunction structure due to the space separation of the two-dimensional electron gas (2DEG) and ionized donors. For instance, the AlGaN/GaN heterojunction that was widely adopted to form HEMTs can yield a 2DEG, thus increasing the electron mobility to over 1500 cm 2 V À1 s À1 . [6] A ZnMgO/ZnO heterojunction reveals the potential for a high-frequency and high-power HEMT application due to the large 2DEG-induced mobility of 250 cm 2