2017
DOI: 10.1002/aelm.201600435
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Electronic Quality Improvement of Highly Defective Quasi‐Mono Silicon Material by Phosphorus Diffusion Gettering

Abstract: Quasi‐mono silicon (QM‐Si) attracts interest as a substrate material for silicon device processing with the promise to yield single‐crystalline silicon quality with multicrystalline silicon cost. A significant barrier to widespread implementation of QM‐Si is ingot edge‐contamination caused by the seed material and crucible walls during crystal growth. This work aims to recover the scrap material in QM‐Si manufacturing with a process easily adaptable to semiconductor device manufacturing. A phosphorus diffusion… Show more

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Cited by 10 publications
(5 citation statements)
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“…As [Cr i ] in most wafers was too low to be determined, only the maximum values that consider 5% relative error in the measured lifetimes are shown in the figure. [Fe i ] was found to be lower compared with those reported in the previous studies . The data measured on an HP mc‐Si ingot from Ref.…”
mentioning
confidence: 51%
“…As [Cr i ] in most wafers was too low to be determined, only the maximum values that consider 5% relative error in the measured lifetimes are shown in the figure. [Fe i ] was found to be lower compared with those reported in the previous studies . The data measured on an HP mc‐Si ingot from Ref.…”
mentioning
confidence: 51%
“…Some of the solar cells, particularly those fabricated on wafers from the 60–80 mm ingot height position and gettered at 811 °C, deteriorated in solar cell efficiency, V OC , and FF. This can be attributed to the proximity of the wafer’s position to the seeds, where the concentration of impurities is usually high, , together with the existence of multicrystalline grains (Figure ). Low temperature gettering (820 °C) has been reported to be less effective in removing precipitated impurities in multicrystalline silicon than high-temperature gettering (880–920 °C) …”
Section: Resultsmentioning
confidence: 99%
“…Ever increasing requirements towards higher efficiencies have led to the development of new and innovative crystal growth technologies that provide better crystal quality and improved electrical properties. Currently the most promising technology is based on a simple and lowcost casting method, 15 % lower manufacturing cost compared to Cz-Si [1], resulting in high quality single crystalline silicon (cast mono-Si), also known as monolike, quasimono or mono 2 silicon [2,3,4,5]. Obviously the quality of cast mono-Si is not high enough for IC or high-purity detectors, but for instance, MEMS technology could find it as an attractive alternative to conventional Cz-Si, especially in applications where lower substrate cost could bring a significant competitive edge, such as disposable applications [6,7].…”
Section: Introductionmentioning
confidence: 99%