Electronics reliability: A state-of-the-art survey

Blanks, Henry S.

doi:10.1016/0026-2714(80)90203-6

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Reliability Growth1

Compatibility Factors: X' X" XC1

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1990

2015

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Cited by 8 publications

(2 citation statements)

References 40 publications

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“…Experience shows that during development and production of electronic products there is a growth of reliability [19]. This is normally attributed to the construction and testing of product prototypes.…”

Section: Reliability Growthmentioning

confidence: 99%

Future Directions and Reliability Issues

Ohring

Kasprzak²

2015

Reliability and Failure of Electronic Materials and Devices

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Section: Reliability Growthmentioning

confidence: 99%

Future Directions and Reliability Issues

Ohring

Kasprzak²

2015

Reliability and Failure of Electronic Materials and Devices

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“…vibration (shipping and handling), component incompatibility from bad selection of components and so forth (Blanks,[4]) should also be considered. Whitbeck and Leemis [19] use a "pseudo-component" to represent assembly defects.…”

Section: Compatibility Factors: X' X" XCmentioning

confidence: 99%

Optimal Burn-in Simulation on Highly Integrated Circuit Systems

Chien

Kuo

1992

IIE Transactions

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Temperature dependence of microelectronic device failures

Pecht

Lall

Whelan

1990

Quality & Reliability Eng

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Recently, the use and the applicability of reliability prediction models for microelectronic devices using the temperature‐dependent Eyring and Arrhenius function, have been criticized. In fact, the temperature dependence of failure mechanisms of microelectronic devices and electronic equipment in general has been questioned. This paper discusses the effect of temperature on microelectronic failure mechanisms at various device failure sites. This paper also presents information on those mechanisms which may be more appropriately modelled by functions dependent on temperature change, the rate of temperature change and spatial temperature gradients.

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Electronics reliability: A state-of-the-art survey

Cited by 8 publications

References 40 publications

Future Directions and Reliability Issues

Future Directions and Reliability Issues

Optimal Burn-in Simulation on Highly Integrated Circuit Systems

Temperature dependence of microelectronic device failures

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