Electroplated copper nanowires as Thermal Interface Materials

Chow, Justin; Sitaraman, Suresh K.

doi:10.1109/itherm.2016.7517542

Cited by 9 publications

(8 citation statements)

References 21 publications

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“…Then, the moving ion undergoes oxidation, and the target component is deposited on the conductive substrate. Electrodeposition commonly involves various parameters, including current density, deposition time, solution concentration, and type of substrate 70,113 …”

Section: Fabrication Methods Of Timsmentioning

confidence: 99%

“…Chow et al 113 electroplated copper nanowire (CuNW) as TIMs. Metallic NWs were electrodeposited through a nanoporous template (anodized aluminum oxide [AAO] membranes or trace etched [TE] membranes).…”

Section: Fabrication Methods Of Timsmentioning

confidence: 99%

“…Electroplating was continued until the NWs filled the pores and formed a continuous metal pad layer. To prevent overplating of the pad, chemical mechanical polishing was performed after the NWs were electroplated to ensure a uniform NW height before the top pad was deposited 113 . The internal thermal resistance of 0.2 mm 2 K/W was obtained for CuNW‐based TIMs.…”

Section: Fabrication Methods Of Timsmentioning

confidence: 99%

“…Electrodeposition commonly involves various parameters, including current density, deposition time, solution concentration, and type of substrate. 70,113 Chow et al 113 electroplated copper nanowire (CuNW) as TIMs. Metallic NWs were electrodeposited through a nanoporous template (anodized aluminum oxide [AAO] membranes or trace etched [TE] membranes).…”

Section: Electrodepositionmentioning

confidence: 99%

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A review of thermal interface material fabrication method toward enhancing heat dissipation

et al. 2020

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Summary Thermal interface materials (TIMs) are applied in electronic devices that are involved in heat generation and raising the temperature. The optimization of TIMs is important in heat dissipation to maintain the good performance of devices, low power during operation, and reduced internal damages among small components. The TIMs are inserted between two contact surfaces to enhance thermal conductivity that will reduce the increment of surface temperature in a longer time and facilitates the cooling process with a consistent power supplied to the system with minimum increment. Research on nanomaterials and hybrid materials aims to obtain maximum thermal conductivity and reduce resistance in the devices. However, the suitable fabrication method for achieving good production and performance is still debatable. Therefore, significant fabrication methods have been explored for various materials. This review provides insights into the current work focusing on the materials used in the development of TIMs by various methods. The discussion begins with the introduction of thermal management and the working principles applied in the system. Then, the methods applied for material fabrication into TIMs, including the advantages and disadvantages of the methods, are discussed. Last, the current challenges and opportunities in methods used are discussed to offer new inputs and improvement in method modification for TIMs design. The targeted thermal performance for the industrial market of TIMs for nanomaterial applications is approximately 100 W/mK and 1 × 10−6 m2/WK with lowest power of 100 W.

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Section: Fabrication Methods Of Timsmentioning

confidence: 99%

Section: Fabrication Methods Of Timsmentioning

confidence: 99%

Section: Fabrication Methods Of Timsmentioning

confidence: 99%

Section: Electrodepositionmentioning

confidence: 99%

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A review of thermal interface material fabrication method toward enhancing heat dissipation

et al. 2020

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“…“continuous” rather than “percolation” network). For over a decade, this approach has focused on synthesizing carbon nanotubes (CNTs) into vertically aligned arrays. − More recent work has explored the use of templated electrodeposition to grow vertically aligned metal NWs, ,− which circumvent many of the challenges facing CNTs including harsh growth conditions, limited capability to tune morphology, and the wide disparity in reported thermal conductivities because of variations in network morphology. ,− Here, we establish vertically aligned CuNW arrays with insertable polymer matrices as high performance TIMs, we characterize their combined thermal and mechanical property data, and we demonstrate practical device integration.…”

Section: Introductionmentioning

confidence: 99%

Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials

Barako

Isaacson

Lian

et al. 2017

ACS Appl. Mater. Interfaces

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Thermal interface materials (TIMs) are essential for managing heat in modern electronics, and nanocomposite TIMs can offer critical improvements. Here, we demonstrate thermally conductive, mechanically compliant TIMs based on dense, vertically aligned copper nanowires (CuNWs) embedded into polymer matrices. We evaluate the thermal and mechanical characteristics of 20-25% dense CuNW arrays with and without polydimethylsiloxane infiltration. The thermal resistance achieved is below 5 mm K W, over an order of magnitude lower than commercial heat sink compounds. Nanoindentation reveals that the nonlinear deformation mechanics of this TIM are influenced by both the CuNW morphology and the polymer matrix. We also implement a flip-chip bonding protocol to directly attach CuNW composites to copper surfaces, as required in many thermal architectures. Thus, we demonstrate a rational design strategy for nanocomposite TIMs that simultaneously retain the high thermal conductivity of aligned CuNWs and the mechanical compliance of a polymer.

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Performance of Carbon Nanotube on Nickel-Plated Copper Substrate Using Electrophoretic Deposition Process for Electronic Cooling Application: Response Surface Method Optimization

Bahru,

Zamri

2024

Arab J Sci Eng

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Electroplated copper nanowires as Thermal Interface Materials

Cited by 9 publications

References 21 publications

A review of thermal interface material fabrication method toward enhancing heat dissipation

A review of thermal interface material fabrication method toward enhancing heat dissipation

Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials

Performance of Carbon Nanotube on Nickel-Plated Copper Substrate Using Electrophoretic Deposition Process for Electronic Cooling Application: Response Surface Method Optimization

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