2001
DOI: 10.1016/s0924-4247(01)00556-8
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Electroplating and characterization of cobalt–nickel–iron and nickel–iron for magnetic microsystems applications

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Cited by 72 publications
(30 citation statements)
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“…As a consequence, the formation of an insoluble Fe x (OH) y intermediate species adsorbed at the electrode surface occurs 30 , hindering the Ni, and promoting the Fe deposition rate. A similar observation was reported previously for pulse reverse deposition of CoFeNi alloys 31 . However the described effect is the weakest for the pulse current densities at which the electrode potential is in the rage of the maximum additive adsorption/coverage at CoFeNi surface (j = -15 mAcm -2 to -25 mAcm -2 , Figure 5).…”
Section: Edx Analysis Of Cofeni Alloyssupporting
confidence: 90%
“…As a consequence, the formation of an insoluble Fe x (OH) y intermediate species adsorbed at the electrode surface occurs 30 , hindering the Ni, and promoting the Fe deposition rate. A similar observation was reported previously for pulse reverse deposition of CoFeNi alloys 31 . However the described effect is the weakest for the pulse current densities at which the electrode potential is in the rage of the maximum additive adsorption/coverage at CoFeNi surface (j = -15 mAcm -2 to -25 mAcm -2 , Figure 5).…”
Section: Edx Analysis Of Cofeni Alloyssupporting
confidence: 90%
“…Poly(dimethylsiloxane) (PDMS) (Slygard 184, Dow Corning) was poured onto the mold, allowed to cure for 1 hour at 65 • C, and peeled off. A lift-off process (Wolf, 1986) was used to define a base layer of evaporated metal (Ti/Au, 10 nm/50 nm) in the form of a microneedle (20 mm in X, 100 μm in Y, 50 μm in Z) or microcomb (3.8 mm in X, 12 mm in Y, 50 μm in Z with teeth 300 μm in X and spaced by 200 μm in Y) on a glass substrate that was then electroplated (1 mA for 4 hr) with a 50 μm thick layer of magnetic material (80% Ni, 20% Fe), as previously described (Rasmussen et al, 2001). The PDMS channel and the glass substrate with the NiFe layer were exposed to oxygen plasma (100 W, 60 sec) and bonded together.…”
Section: Microsystem Fabricationmentioning
confidence: 99%
“…In the present study, we chose a soft magnetic material (NiFe) with low remnant magnetization that was magnetized with an external stationary magnet to facilitate rapid and switchable control of separations. The NiFe layer has a saturation magnetization ∼0.6T (Rasmussen et al, 2001).…”
mentioning
confidence: 99%
“…In the last few years, intensive studies [2,3] have been done on these materials to explore their unique soft magnetic properties. New soft magnetic materials with greater performance are desirable due to rapid increase of areal density (bits per square inch of recording medium) of data storage in computer drives [4], advanced miniaturization and high capability electromagnetic devices in MEMS [5,6]. Numerous Co-based ternary alloys such as Co-Fe-B [7], CoFe-Cu [8] and Co-Ni-Fe [9,10] are among the potential candidates to serve the purpose.…”
Section: Introductionmentioning
confidence: 99%