Influence of Additive Adsorption on Properties of Pulse Deposited CoFeNi Alloys

Brankovic, Stanko R.; Vasiljević, Nataša; Klemmer, T. J.; Johns, Earl

doi:10.1149/1.1864352

Cited by 36 publications

(56 citation statements)

References 30 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These data also show that the increase of ½Fe 3 þ beyond the calculated value of ½Fe 3 þ * i results in significant reduction of B s ($40%). The bold line in Figure 27.4 represents the analytical model that describes the decrease in B s of Co [40][41][42][43][44] Fe 60-56 films as a function of Fe(OH) 3 incorporation [35]. Pulse Current Deposition The typical pulse current function that is employed in the electrodeposition process of soft magnetic alloys has the simple on-off profile shown in Figure 27.5 [3,36].…”

Section: Relation Between Surface Concentration Of H þ and Concentratmentioning

confidence: 99%

“…The last two effects are also important for obtaining ultimately soft magnetic alloys. The presence of additives in the plating solutions results in their incorporation into magnetic deposit [40,[42][43][44][45]. If the amount of the incorporated additives is small, it is generally considered as beneficial for the desired magnetic softness [11,42].…”

Section: Additive Effectmentioning

confidence: 99%

See 1 more Smart Citation

Applications to Magnetic Recording and Microelectronic Technologies

Brankovic¹,

Vasiljević²,

Dimitrov³

2010

Modern Electroplating

Self Cite

View full text Add to dashboard Cite

Early applications of electrodeposition in manufacturing were mainly confined to situations where relatively thick polycrystalline metal deposits were needed. These included protective or sacrificial metal layers for corrosion protection, decorative applications, and situations where metal coatings with specific mechanical properties were needed [1]. However, development of theoretical foundations in electrochemical engineering and electrometallurgy and the sophistication of the tools used for electrodeposition have contributed to widespread electrodeposition in high-tech industry where more rigorous thickness control of the deposit is required. Nowadays, electrodeposition is recognized as a mature deposition method for the fabrication of magnetic thin-film heads [2, 3] and in microelectronics and microelectromechanical system (MEMS) technologies [4][5][6][7]. The most recent developments suggest that electrodeposition is an attractive fabrication process for many emerging fields of nanotechnology. These new applications make the future of electrodeposition research a seemingly interesting and quite exciting endeavor.In this chapter we will review the most important electrodeposition processes used for fabrication of magnetic recording heads and in microelectronics technology. The most important parameters, criteria, and phenomena controlling the deposit morphology and properties are highlighted and discussed using the examples from the authors' own work and from the work of other prominent groups around the world. MAGNETIC RECORDINGNowadays electrodeposition is used for the fabrication of many important parts of magnetic recording heads, including magnetic shields and poles, Cu coils, and for connecting Cu studs, leads and pads, Au interconnects, and nonmagnetic gaps and coatings. Some of these electrodeposition processes and bath chemistries were adopted from other technologies as a common practice. However, the fabrication of the writing pole in magnetic recording heads has been the most important manufacturing step where electrodeposition has gained its fame as a cost-effective, reliable, and high-throughput operation (Fig. 27.1a). Over the years, the development of magnetic reader technologies, recording medias and the geometry of the magnetic recording process have posed many challenges that electrodeposition had to meet in order to stay competitive with other deposition methods. The common requirement for the alloys for magnetic pole fabrication is that they have low coercivity (softness), low magnetostriction (l % 0), and relatively high magnetic moment. The electrodeposition process of these alloys has to be scalable with high-throughput manufacturing with minimum effort in process control and reproducibility. The bath chemistry has to be stable over the time and compatible with other materials and processes used in through-mask fabrication.In the very beginning, the electrodeposited magnetic alloy for magnetic pole application was Ni 81 Fe 19 -Permalloy (inductive read heads)-with saturation magnetic fl...

show abstract

Section: Relation Between Surface Concentration Of H þ and Concentratmentioning

confidence: 99%

Section: Additive Effectmentioning

confidence: 99%

Applications to Magnetic Recording and Microelectronic Technologies

Brankovic¹,

Vasiljević²,

Dimitrov³

2010

Modern Electroplating

Self Cite

View full text Add to dashboard Cite

show abstract

“…The other parameters of the electrodeposition process are the described in Table I [1][2][3]) it is quite obvious that optimum condition for direct current deposition of 2.4 T CoFe films are very sensitive to small changes in pH or magnitude of the deposition current density. In general, for direct current deposition process of any soft magnetic alloys, the bath control should be such that allowed Fe 3+ concentration in the solution is always significantly smaller than the calculated value of The typical pulse current function that is employed in electrodeposition process of soft magnetic alloys for magnetic recording application has the simple on/off profile (5,7,8). The successful application of this pulse function is dependent on the proper determination of the pulse time t on , and the magnitude of the pulse current density j pulse .…”

Section: Direct Current Depositionmentioning

confidence: 99%

“…The example of sulfur incorporation rate into 2.4 T CoFe alloys as a function of saccharine concentration in the plating solution is shown in Figure 3. The dash-dot line in the same figure represents the model fit (equation [8]) to the experimental data. As it could be seen, the model succeeds to qualitatively explain experimental results.…”

Section: Ecs Transactions 16 (45) 75-87 (2009)mentioning

confidence: 99%

Critical Parameters of Solution Design for Electrodeposition of 2.4 T CoFe Alloys

et al. 2009

Self Cite

View full text Add to dashboard Cite

The electrodeposition of soft, high magnetic moment alloys has become the critical fabrication step in manufacturing of magnetic recording heads. The need for ultimately high magnetic moment alloys (2.4 T CoFe) and the electrodeposition process capable of delivering magnetic structures with dimension in the range of several tens of nanometers are the new tasks that have to be addressed if the future magnetic recording devices will use the electrodeposited alloys for writing pole application. This complex challenge could be successfully achieved by fully considering the conditions at the electrochemical interface for additive adsorption and incorporation, iron hydroxide formation and incorporation, and by careful design of the bath chemistry and deposition parameters that would yield the high moment alloys with the optimum magnetic properties. In this manuscript, some of the key aspects of successful electrodeposition of 2.4 T CoFe alloys are discussed with experimental results and theoretical foundations indicating future direction for development of electrodeposited high moment alloys and nanostructures.

show abstract

“…However the variously named additives -wetting agents, leveling agents, brighteners -needed to control deposit morphology and deposition current introduces bath complexities. Different atomic interstitial elements or their intermetallic compounds derived from these additives contaminates the electrodeposited films [7]. In potentiostatic deposition voltage is constant.…”

Section: Introductionmentioning

confidence: 99%

Potentiostatic Co-deposition of Nickel and Graphite Using a Composite Counter Electrode

Aremo¹,

Mo²,

Ib³

2017

J Nanosci Curr Res

View full text Add to dashboard Cite

Nickel and graphite was potentiostatically co-deposited using a composite nickel-graphite composite counter electrode (CCE) with tunable-friability. This was done to achieve steady introduction of graphite into the electrolyte without intermittent mechanical infusion and stirring, thus facilitating a potentiostatic deposition route and promoting homogeneity of deposition. Graphite electrodes were produced at densities of 0.920, 1.026 and 1.188 g/cm 3 and their suitability for constitution in a CCE assessed. The surface area of the nickel component of the CCE was varied from 100% to about 60 and 30% surface area and combined with the graphite electrode to form CCE constitutions designated as triplet, doublet and singlet respectively. Deposition was done for about 8 hours in 1 M NiSO4 using the different CCE constitutions, an Ag/AgCl reference electrode and a custom deposition head which served as the working electrode. The mechanism of graphite electrode unraveling was observed to be the formation of oxygen and CO 2 due to oxidation reactions at the CCE. Graphite electrode of density 0.920 g/cm 3 was selected for the CCE due to its extensive surface porosity, a characteristic determined as favourable to the mechanism of electrode unraveling. Co-deposition of graphite with nickel was observed to increase as nickel surface area was reduced from the triplet to singlet. SEM micrographs show partially and fully embedded graphite particles in the nickel matrix while the presence of nickel and graphite was affirmed.

show abstract

Influence of Additive Adsorption on Properties of Pulse Deposited CoFeNi Alloys

Cited by 36 publications

References 30 publications

Applications to Magnetic Recording and Microelectronic Technologies

Applications to Magnetic Recording and Microelectronic Technologies

Critical Parameters of Solution Design for Electrodeposition of 2.4 T CoFe Alloys

Potentiostatic Co-deposition of Nickel and Graphite Using a Composite Counter Electrode

Contact Info

Product

Resources

About